Intel corporation (20240188222). METHOD OF FORMING A PACKAGE SUBSTRATE simplified abstract
Contents
- 1 METHOD OF FORMING A PACKAGE SUBSTRATE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD OF FORMING A PACKAGE SUBSTRATE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHOD OF FORMING A PACKAGE SUBSTRATE
Organization Name
Inventor(s)
Rahul Manepalli of Chandler AZ (US)
Srinivas Pietambaram of Chandler AZ (US)
Darko Grujicic of Chandler AZ (US)
Marcel Wall of Phoenix AZ (US)
Jason Steill of Phoenix AZ (US)
METHOD OF FORMING A PACKAGE SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240188222 titled 'METHOD OF FORMING A PACKAGE SUBSTRATE
Simplified Explanation
The present disclosure describes a method for creating a substrate core with a glass core layer, through-glass vias, and conductive layers, as well as a defect detection and repair process for the glass core layer.
- Substrate core with glass core layer, through-glass vias, and conductive layers
- Defect detection method used to identify defects in the glass core layer
- Repair process for fixing detected defects in the glass core layer
- Repair can be done immediately or after a group of defects is identified
Potential Applications
The technology described in this patent application could be applied in the manufacturing of electronic devices, such as printed circuit boards or semiconductor devices, where high-quality substrates with through-glass vias are required.
Problems Solved
This technology solves the problem of ensuring the integrity and reliability of substrates with glass core layers by providing a method for detecting and repairing defects in the glass core layer.
Benefits
The benefits of this technology include improved quality control in substrate manufacturing processes, increased reliability of electronic devices, and potentially reduced costs associated with defect repair.
Potential Commercial Applications
The technology could be commercially applied in industries that require high-performance electronic devices, such as telecommunications, aerospace, and automotive sectors.
Possible Prior Art
One possible prior art in this field is the use of defect detection methods in semiconductor manufacturing processes to ensure the quality of substrates and electronic components.
What are the limitations of the defect detection method described in the patent application?
The patent application does not specify the exact techniques or tools used for defect detection in the glass core layer, which could limit the applicability of the method in different manufacturing environments.
How does the repair process for defects in the glass core layer compare to existing repair methods?
The patent application does not provide a comparison with existing repair methods for glass core layers, making it difficult to assess the novelty and effectiveness of the proposed repair process.
Original Abstract Submitted
the present disclosure is directed to a method providing a substrate core having a glass core layer with top and bottom surfaces and a build-up process performing operations to form a plurality of through-glass vias formed through the glass core layer and a plurality of conductive layers on the top and bottom surfaces of the glass core layer. as an integral part of the build-up process, a defect detection method may be used to detect defects in the glass core layer. the inspection for defects may be performed after selected operations. after one or more defect (e.g., crack) is uncovered, a repair process may be performed to repair the defects in the glass core layer. the repair of a defect may be performed immediately upon detection or after selected operations as a comprehensive repair of a group of defects.
