Intel corporation (20240186281). METHOD FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract
Contents
- 1 METHOD FOR PANEL-LEVEL THERMO-COMPRESSION BONDING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD FOR PANEL-LEVEL THERMO-COMPRESSION BONDING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHOD FOR PANEL-LEVEL THERMO-COMPRESSION BONDING
Organization Name
Inventor(s)
Minglu Liu of Chandler AZ (US)
Andrey Gunawan of Paradise Valley AZ (US)
METHOD FOR PANEL-LEVEL THERMO-COMPRESSION BONDING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186281 titled 'METHOD FOR PANEL-LEVEL THERMO-COMPRESSION BONDING
Simplified Explanation
The present disclosure is directed to a thermocompression bonding tool with a bond head for compression and heating, a sensor, a stage for compression and heating, and a controller, along with a method for chip gap height and alignment control.
- The bonding tool includes a bond head with a surface for compression and heating, a sensor, a stage for compression and heating, and a controller.
- The controller is provided with a recipe displacement and temperature profile for chip gap height and alignment control.
- The method involves using the bonding tool to control chip gap height and alignment by utilizing the recipe displacement and temperature profile along with measured offsets.
Potential Applications
This technology can be applied in semiconductor manufacturing, microelectronics assembly, and other industries requiring precise bonding processes.
Problems Solved
This technology solves the problem of achieving accurate chip gap height and alignment during bonding processes, leading to improved overall product quality and performance.
Benefits
The benefits of this technology include increased yield rates, enhanced product reliability, and reduced manufacturing costs due to improved bonding accuracy.
Potential Commercial Applications
Potential commercial applications of this technology include semiconductor packaging, electronic device manufacturing, and medical device assembly.
Possible Prior Art
One possible prior art for this technology could be traditional thermocompression bonding tools without the advanced control features provided by the disclosed tool.
== What are the key components of the thermocompression bonding tool described in the patent application? The key components of the thermocompression bonding tool described in the patent application are the bond head, sensor, stage, and controller.
== How does the controller help in chip gap height and alignment control in the bonding process? The controller helps in chip gap height and alignment control in the bonding process by providing a recipe displacement and temperature profile, along with measured offsets, to ensure precise bonding.
Original Abstract Submitted
the present disclosure is directed to a thermocompression bonding tool having a bond head with a surface for compression and heating and a sensor, a stage for compression and heating, and a controller, and a method for its use for chip gap height and alignment control. for chip gap height and alignment control, the controller is provided with a recipe displacement and temperature profile and measured offsets.
