Intel corporation (20240186280). THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract

THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING

Organization Name

intel corporation

Inventor(s)

Minglu Liu of Chandler AZ (US)

Andrey Gunawan of Paradise Valley AZ (US)

Gang Duan of Chandler AZ (US)

Edvin Cetegen of Chandler AZ (US)

Yuting Wang of Chandler AZ (US)

Mine Kaya of Scottsdale AZ (US)

Kartik Srinivasan of Gilbert AZ (US)

Mihir Oka of Chandler AZ (US)

Anurag Tripathi of Gilbert AZ (US)

THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240186280 titled 'THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING

Simplified Explanation

The present disclosure is directed to an apparatus with a bond head designed to heat and compress a semiconductor package assembly, and a bonding stage that holds the semiconductor package assembly, where the bonding stage is made of a ceramic material containing silicon and either magnesium or indium.

• The apparatus includes a bond head that can apply heat and pressure to a semiconductor package assembly.
• The bonding stage is made of a ceramic material with silicon and either magnesium or indium.

Potential Applications

This technology could be used in semiconductor manufacturing processes, specifically in bonding semiconductor package assemblies.

Problems Solved

This technology solves the problem of efficiently heating and compressing semiconductor package assemblies during the manufacturing process.

Benefits

The benefits of this technology include improved bonding of semiconductor package assemblies, leading to higher quality and reliability of semiconductor devices.

Potential Commercial Applications

One potential commercial application of this technology could be in the production of electronic devices such as smartphones, computers, and other consumer electronics.

Possible Prior Art

Prior art may include similar apparatuses used in semiconductor manufacturing processes, but with different materials or configurations.

== What are the temperature and pressure ranges that the bond head can apply to the semiconductor package assembly? The temperature and pressure ranges that the bond head can apply to the semiconductor package assembly are not specified in the abstract.

== How does the use of a ceramic material in the bonding stage improve the semiconductor package assembly process? The abstract does not provide specific details on how the use of a ceramic material in the bonding stage improves the semiconductor package assembly process.

Original Abstract Submitted

the present disclosure is directed to an apparatus having a bond head configured to heat and compress a semiconductor package assembly, and a bonding stage configured to hold the semiconductor package assembly, wherein the bonding stage comprises a ceramic material including silicon and either magnesium or indium.