Intel corporation (20240186279). IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVICE ATTACHMENT simplified abstract
Contents
- 1 IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVICE ATTACHMENT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVICE ATTACHMENT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVICE ATTACHMENT
Organization Name
Inventor(s)
Minglu Liu of Chandler AZ (US)
Yosuke Kanaoka of Chandler AZ (US)
Jung Kyu Han of Chandler AZ (US)
IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVICE ATTACHMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186279 titled 'IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVICE ATTACHMENT
Simplified Explanation
The present disclosure relates to a system that includes a stage for supporting a substrate, a bondhead for pressing a device against the substrate, and a light source for emitting UV light towards the stage.
- Stage supports substrate
- Bondhead presses device against substrate
- Light source emits UV light towards stage
Potential Applications
The system described in the patent application could be used in the manufacturing of electronic devices, such as semiconductors, by bonding components to substrates using UV light.
Problems Solved
This technology solves the problem of accurately bonding devices to substrates in a controlled manner, which is crucial for the production of high-quality electronic components.
Benefits
The benefits of this technology include precise bonding of devices to substrates, improved efficiency in manufacturing processes, and potentially higher quality electronic products.
Potential Commercial Applications
The system could be utilized in the semiconductor industry for the production of integrated circuits, sensors, and other electronic components. The technology could also be applied in the manufacturing of LED devices.
Possible Prior Art
One possible prior art for this technology could be systems that use different bonding methods, such as thermal bonding or adhesive bonding, but not specifically utilizing UV light for bonding.
What are the safety considerations when using UV light in this system?
UV light can be harmful to human skin and eyes, so proper safety measures must be in place to protect operators working with the system. This may include wearing protective gear such as gloves, goggles, and aprons, as well as ensuring that the UV light source is enclosed to prevent exposure.
How does the use of UV light affect the bonding process compared to other methods?
UV light bonding can offer advantages such as faster curing times, lower energy consumption, and reduced risk of damage to sensitive components. However, it may also require specific materials that are compatible with UV curing, which could impact the overall cost and complexity of the bonding process.
Original Abstract Submitted
the present disclosure relates to a system. the system may include a stage configured to support a substrate. the system may also include a bondhead configured to press a device against the substrate. the system may further include a light source configured to emit uv light towards the stage.
