Intel corporation (20240186264). POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES simplified abstract
Contents
- 1 POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES
Organization Name
Inventor(s)
Eungnak Han of Portland OR (US)
Suddhasattwa Nad of Chandler AZ (US)
Marcel A. Wall of Phoenix AZ (US)
POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186264 titled 'POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES
Simplified Explanation
The patent application describes an apparatus with a glass substrate, a metal layer, and a polymeric layer sandwiched between them. The polymeric layer contains polymer molecules with specific groups attached to a polymer backbone, facilitating bonding to both the glass substrate and the metal layer.
- Glass substrate, metal layer, and polymeric layer make up the apparatus.
- Polymeric layer consists of polymer molecules with R1, R2, and R3 groups attached to a polymer backbone.
- R1 groups bond the polymeric layer to the glass substrate, while R2 groups bond it to the metal layer.
Potential Applications
The technology described in the patent application could be applied in industries such as electronics, optoelectronics, and solar panels.
Problems Solved
This technology solves the problem of adhesion between different materials, specifically glass and metal, which can be challenging due to their different properties.
Benefits
The benefits of this technology include improved bonding strength, durability, and reliability in various applications where glass and metal need to be securely attached.
Potential Commercial Applications
- Electronics manufacturing
- Optoelectronic device production
- Solar panel assembly
Possible Prior Art
There may be prior art related to methods of bonding glass and metal layers in various industries, but specific examples would need to be researched further.
What are the potential environmental impacts of using this technology?
The potential environmental impacts of using this technology could include the need for proper disposal of materials used in the polymeric layer, as well as energy consumption during the manufacturing process. However, if the technology leads to more efficient and durable products, it could also result in longer-lasting devices that reduce overall waste.
How does this technology compare to existing methods of bonding glass and metal layers?
This technology offers a unique approach to bonding glass and metal layers by utilizing specific polymer molecules with different functional groups for bonding. Comparing to traditional methods such as adhesives or mechanical fasteners, this innovative approach may provide advantages in terms of bonding strength, reliability, and longevity of the bond.
Original Abstract Submitted
in one embodiment, an apparatus includes a glass substrate, a metal, and a polymeric layer between the metal and the glass substrate. the polymeric layer includes polymer molecules with an r1 group, an r2 group, a polymer backbone between the r1 group and r2 group, and an r3 group side-attached to the polymer backbone. the polymeric layer is bonded to the glass substrate via the r1 groups and bonded to the metal via the r2 groups.
