Intel corporation (20240186251). SYMMETRIC DUMMY BRIDGE DESIGN FOR FLI ALIGNMENT IMPROVEMENT simplified abstract

SYMMETRIC DUMMY BRIDGE DESIGN FOR FLI ALIGNMENT IMPROVEMENT

Organization Name

intel corporation

Inventor(s)

Minglu Liu of Chandler AZ (US)

YANG Wu of Chandler AZ (US)

Yuting Wang of Chandler AZ (US)

Lawrence Ross of Chandler AZ (US)

Mine Kaya of Scottsdale AZ (US)

Gang Duan of Chandler AZ (US)

Edvin Cetegen of Chandler AZ (US)

Alexander Aguinaga of Phoenix AZ (US)

SYMMETRIC DUMMY BRIDGE DESIGN FOR FLI ALIGNMENT IMPROVEMENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240186251 titled 'SYMMETRIC DUMMY BRIDGE DESIGN FOR FLI ALIGNMENT IMPROVEMENT

Simplified Explanation

The package architecture described in the patent application includes a package substrate with multiple bridges, including conductive routing, positioned symmetrically about each other.

• The package architecture comprises a package substrate with multiple bridges.
• The first bridge in the package substrate includes conductive routing.
• The second bridge and a third bridge are positioned symmetrically about the first bridge.

Potential Applications: This technology could be applied in the semiconductor industry for integrated circuit packaging.

Problems Solved: This package architecture design allows for efficient routing of electrical connections within a package substrate.

Benefits: Improved signal integrity and reduced electromagnetic interference in electronic devices.

Potential Commercial Applications: This technology could be utilized in the development of high-performance electronic devices such as smartphones, tablets, and computers.

Possible Prior Art: Prior art may include traditional package architectures with single bridges for routing connections within a package substrate.

Unanswered Questions: 1. How does this package architecture compare to existing designs in terms of signal transmission efficiency? 2. Are there any limitations to the scalability of this package architecture for larger electronic devices?

Frequently Updated Research: There may be ongoing research in the semiconductor industry on optimizing package architectures for enhanced performance and reliability.

Original Abstract Submitted

embodiments disclosed herein include package architectures. in an embodiment, the package architecture comprises a package substrate, a first bridge in the package substrate, where the first bridge includes conductive routing, and a second bridge in the package substrate. in an embodiment, the package architecture further comprises a third bridge in the package substrate, where the second bridge and the third bridge are positioned symmetrically about the first bridge.