Intel corporation (20240186250). Microelectronic Assembly Including Interconnect Bridges with Through Vias Embedded Therein simplified abstract

Microelectronic Assembly Including Interconnect Bridges with Through Vias Embedded Therein

Organization Name

intel corporation

Inventor(s)

Jeremy D. Ecton of Gilbert AZ (US)

Brandon Christian Marin of Gilbert AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Tarek A. Ibrahim of Mesa AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Hiroki Tanaka of Gilbert AZ (US)

Microelectronic Assembly Including Interconnect Bridges with Through Vias Embedded Therein - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240186250 titled 'Microelectronic Assembly Including Interconnect Bridges with Through Vias Embedded Therein

Simplified Explanation

The microelectronic assembly described in the patent application includes a substrate with a panel made of glass, an interconnect bridge (ib) with interconnect pathways and through vias (ibtvs), electrically conductive structures on the lower surface of the substrate, and an electronic component (ec) layer on the upper surface of the substrate.

• The substrate contains a panel made of glass with an opening, an interconnect bridge (ib) with interconnect pathways and through vias (ibtvs), and electrically conductive structures on the lower surface.
• The electrically conductive structures are coupled to the ibtvs to create vertical electrical connections between the lower and upper surfaces of the substrate.
• The electronic component (ec) layer on the upper surface includes a first active ec (aec) and a second aec electrically coupled through the interconnect pathways, with at least one of them further coupled to the electrically conductive structures.

1. 1. 1. Potential Applications

This technology could be used in microelectronic devices, sensors, and other electronic components that require vertical electrical connections within a compact assembly.

1. 1. 1. Problems Solved

This innovation solves the challenge of creating vertical electrical connections in microelectronic assemblies with glass substrates, improving overall performance and reliability.

1. 1. 1. Benefits

- Enhanced electrical connectivity - Compact design - Improved reliability

1. 1. 1. Potential Commercial Applications

- Microelectronics industry - Sensor technology - Consumer electronics

1. 1. 1. Possible Prior Art

Prior art may include similar microelectronic assembly designs with glass substrates and vertical electrical connections, but specific details would need to be compared to determine novelty.

1. 1. 1. 1. What are the specific materials used in the electrically conductive structures?

The patent application does not provide detailed information on the specific materials used in the electrically conductive structures.

1. 1. 1. 1. How does the interconnect bridge (ib) facilitate the electrical coupling between the electronic components?

The patent application does not elaborate on the specific mechanisms by which the interconnect bridge (ib) enables electrical coupling between the electronic components.

Original Abstract Submitted

a microelectronic assembly includes a substrate comprising: a panel including glass and defining an opening therein; an interconnect bridge (ib) in the opening and including interconnect pathways and ib through vias (ibtvs); and electrically conductive structures at a lower surface of the substrate to electrically couple the substrate to another component, at least some of the electrically conductive structures coupled to the ibtvs to form respective vertical electrical connections between the lower surface of the substrate and an upper surface of the substrate; and an electronic component (ec) layer on the upper surface of the substrate, the ec layer including a first active ec (aec) and a second aec electrically coupled to one another through the interconnect pathways, at least one of the first aec or the second aecs further electrically coupled to one or more of the at least some of the electrically conductive structures.