Intel corporation (20240186202). PACKAGE WITH UNDERFILL CONTAINMENT BARRIER simplified abstract

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

Organization Name

intel corporation

Inventor(s)

Rahul Jain of Gilbert AZ (US)

Kyu Oh Lee of Chandler AZ (US)

Siddharth K. Alur of Chandler AZ (US)

Wei-Lun K. Jen of Chandler AZ (US)

Vipul V. Mehta of Chandler AZ (US)

Ashish Dhall of Chandler AZ (US)

Sri Chaitra J. Chavali of Chandler AZ (US)

Rahul N. Manepalli of Chandler AZ (US)

Amruthavalli P. Alur of Tempe AZ (US)

Sai Vadlamani of Gilbert AZ (US)

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240186202 titled 'PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

Simplified Explanation

The patent application describes an apparatus with a substrate, a die site, a die side component site, and a raised barrier containing electroplated metal to hold underfill material at the die site.

• Substrate with die site and die side component site
• Raised barrier with electroplated metal between die and die side component sites
• Contains underfill material at die site

Potential Applications

The technology could be used in semiconductor manufacturing, electronic packaging, and microelectronics industries.

Problems Solved

The raised barrier helps contain underfill material, preventing leakage and ensuring proper encapsulation of the die.

Benefits

Improved reliability and performance of electronic devices, enhanced protection of delicate components, and increased efficiency in manufacturing processes.

Potential Commercial Applications

Potential commercial applications include the production of integrated circuits, sensors, and other electronic devices requiring precise encapsulation and protection.

Possible Prior Art

Previous methods of containing underfill material in electronic packaging may have involved different barrier materials or structures, but the use of electroplated metal for this purpose may be a novel approach.

What are some questions that are not answered by this article?

How does the electroplated metal barrier compare to other types of barriers in terms of effectiveness and cost?

The effectiveness and cost comparison of the electroplated metal barrier with other types of barriers could provide valuable insights into the competitiveness of this technology in the market.

Are there any limitations or challenges associated with the use of electroplated metal as a barrier in electronic packaging?

Exploring any limitations or challenges related to the use of electroplated metal barriers could help in understanding the potential drawbacks of this technology and identifying areas for further improvement.

Original Abstract Submitted

an apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. other embodiments are also disclosed and claimed.