Intel corporation (20240184209). LITHOGRAPHIC PROCESSES FOR MAKING POLYMER-BASED ELEMENTS simplified abstract
Contents
- 1 LITHOGRAPHIC PROCESSES FOR MAKING POLYMER-BASED ELEMENTS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LITHOGRAPHIC PROCESSES FOR MAKING POLYMER-BASED ELEMENTS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 What are the limitations of this technology in terms of scalability and cost-effectiveness?
- 1.11 How does this technology compare to existing lithographic patterning systems in terms of resolution and efficiency?
- 1.12 Original Abstract Submitted
LITHOGRAPHIC PROCESSES FOR MAKING POLYMER-BASED ELEMENTS
Organization Name
Inventor(s)
Changhua Liu of Chandler AZ (US)
Robert May of Chandler AZ (US)
LITHOGRAPHIC PROCESSES FOR MAKING POLYMER-BASED ELEMENTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240184209 titled 'LITHOGRAPHIC PROCESSES FOR MAKING POLYMER-BASED ELEMENTS
Simplified Explanation
The present disclosure is directed to a lithographic patterning system involving a stage for supporting a substrate with a photo-definable polymer layer, a first actinic radiation source, a first mask, a second actinic radiation source, and a second mask. In a method, first and second propagated lights intersect in the photo-definable polymer layer to form a patterned semiconductor component.
- Lithographic patterning system with multiple actinic radiation sources and masks
- Intersection of propagated lights in the photo-definable polymer layer to form semiconductor components
Potential Applications
The technology can be used in the semiconductor industry for advanced patterning processes.
Problems Solved
This technology enables precise patterning of semiconductor components with high accuracy.
Benefits
- Improved resolution in semiconductor patterning - Enhanced control over the patterning process
Potential Commercial Applications
Advanced semiconductor manufacturing processes
Possible Prior Art
Prior art may include similar lithographic patterning systems with multiple radiation sources and masks.
What are the limitations of this technology in terms of scalability and cost-effectiveness?
The scalability of this technology may be limited by the complexity of the system and the cost of multiple radiation sources and masks.
How does this technology compare to existing lithographic patterning systems in terms of resolution and efficiency?
This technology may offer improved resolution and efficiency compared to existing systems due to the use of multiple actinic radiation sources and masks.
Original Abstract Submitted
the present disclosure is directed to a lithographic patterning system including a stage for supporting a substrate with a photo-definable polymer layer, a first actinic radiation source, which is configured to propagate light along a first optical axis, a first mask for patterning the propagated light from the first actinic radiation source, a second actinic radiation source, which is configured to propagate light along a second optical axis, and a second mask for patterning the propagated light from the second actinic radiation source. in a method, first and second propagated lights form an intersection in the photo-definable polymer layer, and a patterned semiconductor component is formed at the intersection.
