Intel corporation (20240178207). PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract
Contents
- 1 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
Organization Name
Inventor(s)
Jeremy Ecton of Gilbert AZ (US)
Brandon C. Marin of Gilbert AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178207 titled 'PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
Simplified Explanation
The patent application describes a photonic assembly involving an interposer with through-glass vias (TGVs), a photonic integrated circuit (PIC), and an optical component, all optically coupled through the interposer.
- Interposer with through-glass vias (TGVs) made of glass material
- Photonic integrated circuit (PIC) optically and electrically coupled to the interposer
- Optical component optically coupled to the interposer through an optical pathway
Potential Applications
This technology could be applied in:
- High-speed data communication systems
- Optical networking equipment
- Telecommunications devices
Problems Solved
- Efficient optical coupling between components
- Integration of different optical elements in a compact space
Benefits
- Improved signal transmission
- Compact design
- Enhanced performance of photonic devices
Potential Commercial Applications
Optical networking equipment for:
- Data centers
- Telecommunication companies
- Internet service providers
Possible Prior Art
One possible prior art could be the use of traditional electrical interposers for connecting electronic components, but not specifically designed for optical applications.
Unanswered Questions
How does this technology compare to existing photonic assembly methods?
This article does not provide a direct comparison with existing photonic assembly methods.
What are the specific materials used in the optical glue for optically coupling the PIC to the interposer?
The article does not specify the exact materials used in the optical glue for optically coupling the PIC to the interposer.
Original Abstract Submitted
microelectronic assemblies, related devices and methods, are disclosed herein. in some embodiments, a photonic assembly may include an interposer having a surface, wherein a material of the interposer includes glass and the interposer includes through-glass vias (tgvs); a photonic integrated circuit (pic) optically coupled to the surface of the interposer by optical glue or fusion bonding and electrically coupled to the tgvs in the interposer by hybrid bond interconnects; and an optical component optically coupled to the interposer, wherein the optical component is optically coupled to the pic by an optical pathway through the interposer.
