Intel corporation (20240178157). SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE simplified abstract

SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE

Organization Name

intel corporation

Inventor(s)

Vinith Bejugam of Chandler AZ (US)

Whitney Bryks of Tempe AZ (US)

Brandon C. Marin of Gilbert AZ (US)

Vishal Bhimrao Zade of Chandler AZ (US)

Deniz Turan of Chandler AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240178157 titled 'SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE

Simplified Explanation

The abstract describes a patent application related to package substrates, specifically focusing on a core made of glass and buildup layers with a shape memory polymer (SMP).

• Package substrate with a glass core and buildup layers
• Incorporation of a shape memory polymer (SMP) over the core

Potential Applications

The technology described in the patent application could be used in various industries such as electronics, automotive, aerospace, and medical devices.

Problems Solved

1. Improved durability and reliability of package substrates 2. Enhanced thermal and mechanical properties due to the use of shape memory polymer

Benefits

1. Increased resistance to temperature fluctuations 2. Potential for miniaturization of electronic components 3. Enhanced shock absorption capabilities

Potential Commercial Applications

Optimizing Package Substrates with Glass Core and Shape Memory Polymer for Enhanced Performance

Possible Prior Art

Prior art may include existing package substrate designs with different core materials and without the use of shape memory polymers.

How does the incorporation of a shape memory polymer impact the overall cost of manufacturing package substrates?

The abstract does not provide information on the cost implications of using a shape memory polymer in package substrates. It would be important to understand if the benefits outweigh the potential increase in manufacturing costs.

Are there any specific limitations or challenges associated with using a glass core in package substrates?

The abstract does not mention any limitations or challenges that may arise from using a glass core in package substrates. It would be valuable to explore any potential drawbacks or constraints of this design choice.

Original Abstract Submitted

embodiments disclosed herein include package substrates. in a particular embodiment, the package substrate comprises a core. the core may be a glass core. in an embodiment, buildup layers are provided over the core, and a shape memory polymer (smp) is provided over the core.