Intel corporation (20240178151). OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT simplified abstract
Contents
- 1 OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT
Organization Name
Inventor(s)
Minglu Liu of Chandler AZ (US)
Alexander Aguinaga of Phoenix AZ (US)
Jung Kyu Han of Chandler AZ (US)
Yosuke Kanaoka of Chandler AZ (US)
Robin Mcree of Chandler AZ (US)
Hong Seung Yeon of Chandler AZ (US)
OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178151 titled 'OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT
Simplified Explanation
The package architecture described in the abstract includes a first substrate with a fiducial mark, a second substrate made of glass with a fiducial mark, and the second fiducial mark overlapping the first fiducial mark.
- The package architecture includes a first substrate with a fiducial mark.
- The second substrate is made of glass and has a fiducial mark.
- The second fiducial mark overlaps with the first fiducial mark.
Potential Applications
The technology described in this patent application could be applied in the following areas:
- Semiconductor packaging
- Microelectronics manufacturing
- Optical device assembly
Problems Solved
This technology helps in:
- Improving alignment accuracy in packaging processes
- Enhancing the reliability of electronic devices
- Streamlining manufacturing processes
Benefits
The benefits of this technology include:
- Increased precision in alignment
- Reduced manufacturing defects
- Enhanced product quality and performance
Potential Commercial Applications
A potential commercial application for this technology could be in:
- Semiconductor industry for advanced packaging solutions
Possible Prior Art
One possible prior art for this technology could be the use of fiducial marks in semiconductor packaging processes to ensure accurate alignment during assembly.
Unanswered Questions
How does this technology compare to existing alignment methods in terms of accuracy and efficiency?
The article does not provide a direct comparison with existing alignment methods in terms of accuracy and efficiency.
Are there any limitations or challenges associated with implementing this package architecture in large-scale manufacturing processes?
The article does not address any limitations or challenges associated with implementing this package architecture in large-scale manufacturing processes.
Original Abstract Submitted
embodiments disclosed herein include a package architecture. in an embodiment, the package architecture comprises a first substrate with a first fiducial mark on a surface of the first substrate. in an embodiment, the package architecture further comprises a second substrate over the first substrate, where the second substrate comprises glass and a second fiducial mark on the second substrate, and where a footprint of the second fiducial mark at least partially overlaps a footprint of the first fiducial mark.
