Intel corporation (20240178146). INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract
Contents
- 1 INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES
Organization Name
Inventor(s)
Benjamin T. Duong of Phoenix AZ (US)
Whitney Bryks of Tempe AZ (US)
Kristof Kuwawi Darmawikarta of Chandler AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Ravindranath Vithal Mahajan of Chandler AZ (US)
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178146 titled 'INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES
Simplified Explanation
The patent application describes microelectronic assemblies with strengthened glass cores, including a first region with a certain concentration of ions, a second region with a higher concentration of ions, a dielectric with a conductive pathway, and an interconnect coupling the dielectric to the core.
- Glass core with strengthened regions of different ion concentrations
- Dielectric with a conductive pathway at the surface of the glass core
- Interconnect coupling the dielectric to the core
Potential Applications
The technology described in the patent application could be applied in various fields such as:
- Microelectronics
- Semiconductor industry
- Telecommunications
Problems Solved
The technology addresses several issues in microelectronic assemblies, including:
- Strengthening glass cores for improved durability
- Enhancing conductivity in dielectric materials
- Facilitating interconnectivity in microelectronic devices
Benefits
The use of strengthened glass cores in microelectronic assemblies offers several benefits, such as:
- Increased durability and reliability
- Improved performance and conductivity
- Enhanced interconnectivity and integration
Potential Commercial Applications
The technology has potential commercial applications in industries such as:
- Electronics manufacturing
- Telecommunications equipment
- Consumer electronics
Possible Prior Art
One possible prior art could be the use of reinforced glass in electronic devices to improve durability and performance. Another could be the development of conductive pathways in dielectric materials for enhanced conductivity.
Unanswered Questions
How does the technology compare to existing methods of strengthening glass cores in microelectronic assemblies?
The article does not provide a direct comparison to existing methods of strengthening glass cores in microelectronic assemblies. It would be helpful to know the specific advantages or differences of this technology compared to traditional methods.
What are the potential limitations or challenges in implementing this technology on a larger scale in commercial applications?
The article does not address potential limitations or challenges in implementing this technology on a larger scale in commercial applications. It would be important to understand any obstacles or constraints that could arise in the widespread adoption of this innovation.
Original Abstract Submitted
disclosed herein are microelectronic assemblies including strengthened glass cores, as well as related devices and methods. in some embodiments, a microelectronic assembly may include a glass core having a surface, a first region having a first concentration of ions extending from the surface of the core to a first depth; a second region having a second concentration of ions greater than the first concentration of ions, the second region between the first region and the surface of the core; a dielectric with a conductive pathway at the surface of the glass core; and a die electrically coupled to the conductive pathway in the dielectric at the surface of the core by an interconnect.
