Intel corporation (20240178119). RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES simplified abstract
Contents
- 1 RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES
Organization Name
Inventor(s)
Mohammad Mamunur Rahman of Gilbert AZ (US)
Jeremy D. Ecton of Gilbert AZ (US)
RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178119 titled 'RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES
Simplified Explanation
The abstract describes an interconnect with a substrate and a pad, where a hole is provided through the pad, exposing a portion of the substrate, and solder bridges across the hole through the pad.
- The interconnect includes a substrate and a pad.
- A hole is provided through the pad, exposing a portion of the substrate.
- Solder is provided over the pad, bridging across the hole through the pad.
Potential Applications
This technology could be applied in various electronic devices and circuit boards where reliable interconnections are required.
Problems Solved
This technology solves the problem of creating secure and stable interconnections between components in electronic devices.
Benefits
The benefits of this technology include improved reliability, durability, and performance of electronic devices due to the secure interconnections provided by the interconnect design.
Potential Commercial Applications
- "Innovative Interconnect Design for Enhanced Electronic Device Performance"
Possible Prior Art
No prior art is known at this time.
Unanswered Questions
How does the size of the hole impact the performance of the interconnect?
The size of the hole could potentially affect the strength and conductivity of the interconnect. Further research is needed to determine the optimal hole size for different applications.
What materials are used for the substrate and pad in this interconnect design?
The materials used for the substrate and pad could impact the overall performance and reliability of the interconnect. Understanding the specific materials used would provide valuable insights into the design and functionality of the interconnect.
Original Abstract Submitted
embodiments disclosed herein include an interconnect. in an embodiment, the interconnect comprises a substrate and a pad over the substrate. in an embodiment, a hole is provided through the pad. in an embodiment, the hole exposes a portion of the substrate. in an embodiment, a solder is provided over the pad, and the solder bridges across the hole through the pad.
