Intel corporation (20240178097). PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract
Contents
- 1 PERMANENT LAYER FOR BUMP CHIP ATTACH
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PERMANENT LAYER FOR BUMP CHIP ATTACH - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PERMANENT LAYER FOR BUMP CHIP ATTACH
Organization Name
Inventor(s)
Frederick Atadana of Hillsboro OR (US)
Jean Bosco Kana Kana of Chandler AZ (US)
Shripad Gokhale of Gilbert AZ (US)
Xavier F. Brun of Chandler AZ (US)
PERMANENT LAYER FOR BUMP CHIP ATTACH - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178097 titled 'PERMANENT LAYER FOR BUMP CHIP ATTACH
Simplified Explanation
The patent application describes microelectronics package architectures utilizing glass layers and methods of manufacturing the same. The packages include a silicon layer, dies, and a glass layer, with the silicon layer containing vias, the dies in electrical communication with the vias, and the glass layer containing interconnects in electrical communication with the vias.
- Silicon layer with vias
- Dies in electrical communication with vias
- Glass layer with interconnects in electrical communication with vias
Potential Applications
The technology described in the patent application could be applied in various industries such as electronics, telecommunications, and automotive for the development of advanced microelectronics packages.
Problems Solved
This technology solves the problem of improving the performance and reliability of microelectronics packages by utilizing glass layers for interconnects, enhancing electrical communication between components.
Benefits
The benefits of this technology include increased efficiency, higher reliability, and improved performance of microelectronics packages. Additionally, the use of glass layers can lead to cost savings in manufacturing processes.
Potential Commercial Applications
- Advanced microelectronics packaging solutions for electronics industry
- High-performance components for telecommunications sector
- Reliable and efficient microelectronics packages for automotive applications
Possible Prior Art
There may be prior art related to microelectronics packaging using glass layers for interconnects, but specific examples are not provided in the patent application.
Unanswered Questions
How does this technology compare to traditional microelectronics packaging methods?
This article does not provide a direct comparison between the technology described and traditional microelectronics packaging methods. It would be beneficial to understand the specific advantages and disadvantages of this innovative approach.
What are the potential limitations or challenges in implementing this technology on a large scale?
The article does not address any potential limitations or challenges that may arise when implementing this technology on a large scale. Understanding these factors could be crucial for assessing the feasibility and scalability of the innovation.
Original Abstract Submitted
disclosed herein are microelectronics package architectures utilizing glass layers and methods of manufacturing the same. the microelectronics packages may include a silicon layer, dies, and a glass layer. the silicon layer may include vias. the dies may be in electrical communication with vias. the glass layer may include interconnects in electrical communication with the vias.
