Intel corporation (20240178084). INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES
Organization Name
Inventor(s)
Soham Agarwal of Chandler AZ (US)
Benjamin T. Duong of Phoenix AZ (US)
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178084 titled 'INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES
Simplified Explanation
The patent application describes microelectronic assemblies with strengthened glass cores, dielectrics, and interconnects. Here is a simplified explanation of the abstract:
- Glass core with varying ion concentrations
- Dielectric with conductive pathway
- Interconnect coupling dielectric to core surface
- Potential Applications
The technology could be used in various microelectronic devices such as sensors, actuators, and communication devices.
- Problems Solved
The strengthened glass core improves the durability and reliability of microelectronic assemblies, reducing the risk of damage or failure.
- Benefits
Enhanced strength and stability of the glass core lead to longer-lasting and more robust microelectronic devices.
- Potential Commercial Applications
The technology could be applied in the manufacturing of smartphones, tablets, wearables, and other consumer electronics for improved performance and longevity.
- Possible Prior Art
Prior art may include patents related to glass strengthening techniques in microelectronics or dielectric materials with conductive pathways.
- Unanswered Questions
- How does the ion concentration affect the performance of the microelectronic assembly?
The specific impact of ion concentration on the functionality and efficiency of the assembly is not detailed in the abstract.
- Are there any limitations to the use of strengthened glass cores in microelectronic devices?
The potential drawbacks or constraints of implementing strengthened glass cores in various applications are not discussed in the abstract.
Original Abstract Submitted
disclosed herein are microelectronic assemblies including strengthened glass cores, as well as related devices and methods. in some embodiments, a microelectronic assembly may include a core made of glass and having a surface, the core further including a first region having a first concentration of ions and a second region having a second concentration of ions at the surface of the core; and a third region having a third concentration of ions, wherein the second region is between the third region and the surface of the core, and wherein the third concentration of ions is less than the first and second concentrations of ions; a dielectric with a conductive pathway at the surface of the core; and a die electrically coupled to the conductive pathway in the dielectric at the surface of the core by an interconnect.
