Intel corporation (20240177918). GLASS EMBEDDED TRUE AIR CORE INDUCTORS simplified abstract
Contents
- 1 GLASS EMBEDDED TRUE AIR CORE INDUCTORS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 GLASS EMBEDDED TRUE AIR CORE INDUCTORS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
GLASS EMBEDDED TRUE AIR CORE INDUCTORS
Organization Name
Inventor(s)
Suddhasattwa Nad of Chandler AZ (US)
Brandon C. Marin of Gilbert AZ (US)
Jeremy D. Ecton of Gilbert AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Mohammad Mamunur Rahman of Gilbert AZ (US)
GLASS EMBEDDED TRUE AIR CORE INDUCTORS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240177918 titled 'GLASS EMBEDDED TRUE AIR CORE INDUCTORS
Simplified Explanation
The patent application abstract describes a package core with specific features such as a core substrate, openings, and conductive structures.
- The package core includes a core substrate with a first opening and a second opening adjacent to the first opening.
- There is a first electrically conductive structure around the core substrate between the first and second openings.
- Additionally, there may be a second electrically conductive structure around the core substrate outside of the openings.
Potential Applications
This technology could be applied in electronic packaging, semiconductor devices, and integrated circuits.
Problems Solved
This technology helps in providing electrical conductivity and structural support within a package core.
Benefits
The benefits of this technology include improved electrical performance, enhanced structural integrity, and potentially reduced manufacturing costs.
Potential Commercial Applications
Potential commercial applications of this technology could be in the semiconductor industry, electronics manufacturing, and telecommunications.
Possible Prior Art
One possible prior art could be similar package core designs used in electronic devices and semiconductor packaging.
Unanswered Questions
How does this technology impact the overall size of the package core?
The abstract does not provide information on whether this technology affects the overall size of the package core.
What materials are typically used for the conductive structures in the package core?
The abstract does not specify the materials commonly used for the conductive structures in the package core.
Original Abstract Submitted
embodiments disclosed herein include a package core. in an embodiment, the package core comprises a core substrate, a first opening through the core substrate, a second opening through the core substrate and adjacent to the first opening, and a first structure around the core substrate between the first opening and the second opening. in an embodiment, the first structure is electrically conductive. the package core may further comprise a second structure around the core substrate outside of the first opening and the second opening, where the second structure is electrically conductive.
