Intel corporation (20240176085). PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract
Contents
- 1 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
Organization Name
Inventor(s)
Jeremy Ecton of Gilbert AZ (US)
Brandon C. Marin of Gilbert AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240176085 titled 'PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
Simplified Explanation
The patent application describes a photonic assembly that includes a substrate with a core made of glass, a dielectric material with conductive pathways on the core's surface, a photonic integrated circuit (PIC) electrically coupled to the conductive pathways, optical components, and optical pathways for coupling the components.
- Core made of glass
- Dielectric material with conductive pathways
- Photonic integrated circuit (PIC) electrically coupled to the conductive pathways
- Optical components for transmitting light
- Optical pathways for coupling the components
Potential Applications
The technology described in this patent application could be applied in telecommunications, data centers, optical computing, and medical devices.
Problems Solved
This technology solves the problem of efficiently transmitting and processing optical signals in microelectronic assemblies.
Benefits
The benefits of this technology include improved performance, reduced signal loss, increased data transmission speeds, and miniaturization of optical components.
Potential Commercial Applications
The technology could be commercialized for use in telecommunications equipment, data center infrastructure, optical sensors, and medical imaging devices.
Possible Prior Art
One possible prior art for this technology could be the use of optical fibers in telecommunications and data transmission systems.
Unanswered Questions
How does this technology compare to existing photonic assembly solutions in terms of cost and scalability?
This article does not provide information on the cost-effectiveness and scalability of the described technology compared to existing solutions.
What are the potential challenges in integrating this technology into existing microelectronic assemblies?
The article does not address the potential challenges that may arise when integrating this technology into current microelectronic assemblies.
Original Abstract Submitted
microelectronic assemblies, related devices and methods, are disclosed herein. in some embodiments, a photonic assembly may include a substrate having a core with a surface, wherein a material of the core includes glass; and a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways; a photonic integrated circuit (pic) electrically coupled to the conductive pathways in the dielectric material; a first optical component between the pic and the surface of the core, wherein the first optical component is along a perimeter of the core; and a second optical component coupled to the first optical component, wherein the second optical component is optically coupled to the pic by an optical pathway through the first optical component.
