Intel corporation (20240176084). PHOTONIC INTEGRATED CIRCUIT (PIC) FIRST PATCH ARCHITECTURE simplified abstract
Contents
- 1 PHOTONIC INTEGRATED CIRCUIT (PIC) FIRST PATCH ARCHITECTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTONIC INTEGRATED CIRCUIT (PIC) FIRST PATCH ARCHITECTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.9.1 Unanswered Questions
- 1.9.2 How does the technology compare to existing methods of electrical and optical interconnections in terms of performance and reliability?
- 1.9.3 What are the potential challenges or limitations of implementing this technology on a large scale in manufacturing processes?
- 1.10 Original Abstract Submitted
PHOTONIC INTEGRATED CIRCUIT (PIC) FIRST PATCH ARCHITECTURE
Organization Name
Inventor(s)
Jeremy D. Ecton of Gilbert AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Brandon Christian Marin of Gilbert AZ (US)
PHOTONIC INTEGRATED CIRCUIT (PIC) FIRST PATCH ARCHITECTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240176084 titled 'PHOTONIC INTEGRATED CIRCUIT (PIC) FIRST PATCH ARCHITECTURE
Simplified Explanation
The abstract describes a patent application for a pic first patch architecture that includes a solderless electrical connection at a die interconnect surface. Redistribution layers (RDLs) are patterned onto the face of an integrated circuit (IC) die and photonic integrated circuit (PIC) die before being placed into a cavity in a glass layer. Optical interconnections for the PIC die are protected during RDL patterning, and optical waveguides may be patterned into the glass layer before or after assembling the pic first patch including the RDL and glass layer.
- Solderless electrical connection at a die interconnect surface
- Redistribution layers (RDLs) patterned onto IC and PIC dies before placement into a glass layer cavity
- Protection of optical interconnections for the PIC die during RDL patterning
- Optical waveguides may be patterned into the glass layer before or after assembling the pic first patch
Potential Applications
The technology could be applied in the development of advanced integrated circuits and photonic integrated circuits for various industries such as telecommunications, data centers, and aerospace.
Problems Solved
The innovation solves the problem of achieving efficient electrical and optical connections in a compact and reliable manner within integrated circuits and photonic integrated circuits.
Benefits
The benefits of this technology include improved performance, reduced size, enhanced reliability, and simplified manufacturing processes for integrated circuits and photonic integrated circuits.
Potential Commercial Applications
The technology could be commercially applied in the production of high-speed data communication systems, optical sensors, medical devices, and other advanced electronic and photonic devices.
Possible Prior Art
Prior art in the field of integrated circuits and photonic integrated circuits may include traditional methods of electrical and optical interconnections, such as soldering and manual assembly processes.
Unanswered Questions
How does the technology compare to existing methods of electrical and optical interconnections in terms of performance and reliability?
The article does not provide a direct comparison between the new technology and existing methods in terms of performance and reliability.
What are the potential challenges or limitations of implementing this technology on a large scale in manufacturing processes?
The article does not address the potential challenges or limitations of implementing this technology on a large scale in manufacturing processes.
Original Abstract Submitted
a pic first patch architecture includes a solderless electrical connection at a die interconnect surface. redistribution layers (rdls) are patterned onto a face of an integrated circuit (ic) die and photonic integrated circuit (pic) die prior to placement of the rdls into a cavity in a glass layer. optical interconnections for the pic die are protected during rdl patterning and optical waveguides may be patterned into the glass layer fore or after assembling the pic first patch including the rdl and glass layer.
