Intel corporation (20240176070). PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract
Contents
- 1 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
Organization Name
Inventor(s)
Jeremy Ecton of Gilbert AZ (US)
Brandon C. Marin of Gilbert AZ (US)
Changhua Liu of Chandler AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Hiroki Tanaka of Gilbert AZ (US)
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240176070 titled 'PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
Simplified Explanation
The patent application describes a photonic assembly that includes a substrate with a core made of glass, a dielectric material with conductive pathways on the core surface, a photonic integrated circuit (PIC) electrically coupled to the conductive pathways, optical components coupled to the core, and an optical pathway through the core for optical coupling.
- Substrate with glass core and dielectric material with conductive pathways
- Photonic integrated circuit (PIC) electrically coupled to the conductive pathways
- Optical components coupled to the core for optical coupling
Potential Applications
The technology described in the patent application could be applied in telecommunications, data centers, optical computing, and medical devices.
Problems Solved
The technology solves the problem of efficiently integrating photonic components on a substrate with a glass core, enabling high-speed data transmission and optical signal processing.
Benefits
The benefits of this technology include improved performance, reduced signal loss, compact size, and enhanced reliability in photonic assemblies.
Potential Commercial Applications
The potential commercial applications of this technology could include optical communication systems, fiber optic networks, sensor devices, and medical imaging equipment.
Possible Prior Art
One possible prior art could be the integration of photonic components on substrates with different materials, such as silicon or polymers, but not specifically on a glass core with a dielectric material and conductive pathways.
Unanswered Questions
1. How does the optical glue or fusion bonding technique used to couple the optical components to the core affect the overall performance and reliability of the photonic assembly? 2. Are there any specific limitations or challenges in scaling up this technology for mass production and commercialization?
Original Abstract Submitted
microelectronic assemblies, related devices and methods, are disclosed herein. in some embodiments, a photonic assembly may include a substrate having a core with a surface, wherein a material of the core includes glass; and a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways; a photonic integrated circuit (pic) electrically coupled to the conductive pathways in the dielectric material; a first optical component between the pic and the surface of the core, wherein the first optical component is coupled to the surface of the core by optical glue or by fusion bonding; and a second optical component coupled to the core, wherein the second optical component is optically coupled to the pic by an optical pathway through the core and the first optical component.
