Intel corporation (20240176068). PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract
Contents
- 1 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
Organization Name
Inventor(s)
Xiaoqian Li of Chandler AZ (US)
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240176068 titled 'PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
Simplified Explanation
The patent application describes a microelectronic assembly that includes a substrate with a glass core, a dielectric material with conductive pathways, a photonic integrated circuit (PIC), a processor integrated circuit (XPU), and optical components.
- Glass core substrate with dielectric material and conductive pathways
- Photonic integrated circuit (PIC) coupled to the core with active surface facing away
- Processor integrated circuit (XPU) electrically coupled to conductive pathways and active surface of PIC
- First optical component optically coupled to lateral surface of PIC and core
- Second optical component coupled to core, optically coupled to PIC through first optical component and core
Potential Applications
The technology described in the patent application could be applied in telecommunications, data centers, and high-speed computing applications.
Problems Solved
The microelectronic assembly solves the problem of integrating photonic and electronic components in a compact and efficient manner.
Benefits
The benefits of this technology include improved data transfer speeds, reduced power consumption, and increased reliability in electronic systems.
Potential Commercial Applications
The microelectronic assembly could be commercialized for use in high-performance computing systems, telecommunications infrastructure, and data center networking equipment.
Possible Prior Art
One possible prior art could be the integration of photonic and electronic components in microelectronic assemblies for high-speed data processing applications.
Unanswered Questions
How does the microelectronic assembly handle heat dissipation?
The patent application does not provide details on how heat generated by the components is managed within the assembly.
What materials are used in the fabrication of the optical components?
The patent application does not specify the materials used in the construction of the optical components.
Original Abstract Submitted
microelectronic assemblies, related devices and methods, are disclosed herein. in some embodiments, a microelectronic assembly may include a substrate having a glass core with a surface and a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways; a photonic integrated circuit (pic) having an active surface, wherein the pic is coupled to the surface of the core with the active surface facing away from the core; a processor integrated circuit (xpu) electrically coupled to the conductive pathways in the dielectric material and to the active surface of the pic; a first optical component optically coupled to a lateral surface of the pic and to the surface of the core; and a second optical component coupled to the core, wherein the second optical component is optically coupled to the pic by an optical pathway through the first optical component and the core.
