Intel corporation (20240173953). METHOD AND APPARATUS FOR LAMINATING A FILM ON A SUBSTRATE simplified abstract

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METHOD AND APPARATUS FOR LAMINATING A FILM ON A SUBSTRATE

Organization Name

intel corporation

Inventor(s)

Joshua Stacey of Chandler AZ (US)

Thomas Heaton of Gilbert AZ (US)

Dilan Seneviratne of Phoenix AZ (US)

METHOD AND APPARATUS FOR LAMINATING A FILM ON A SUBSTRATE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240173953 titled 'METHOD AND APPARATUS FOR LAMINATING A FILM ON A SUBSTRATE

Simplified Explanation

The present disclosure is directed to an apparatus including a first laminating component configured to laminate a dry film onto a substrate using heat, and a focused cure module configured to selectively cure a first portion of the dry film without curing a second portion of the dry film. The first portion forms a perimeter that surrounds the second portion.

  • Explanation of the patent/innovation:
   - Apparatus for laminating dry film onto a substrate with heat.
   - Focused cure module selectively cures specific portions of the dry film.
   - First portion of the dry film is cured to form a perimeter around the second portion.

Potential Applications

This technology could be applied in industries such as electronics manufacturing, automotive, aerospace, and medical devices where precise lamination and curing processes are required.

Problems Solved

- Ensures accurate and controlled curing of specific areas of the dry film. - Prevents over-curing or under-curing of the film. - Improves overall quality and reliability of laminated products.

Benefits

- Enhanced precision in lamination and curing processes. - Cost-effective solution for producing high-quality laminated products. - Increased efficiency and productivity in manufacturing operations.

Potential Commercial Applications

Optimizing Lamination and Curing Processes for Enhanced Product Quality

Possible Prior Art

Prior art may include similar apparatus or methods used in the lamination and curing processes, but the specific combination of a laminating component with a focused cure module for selective curing may be novel.

Unanswered Questions

How does this technology compare to traditional lamination and curing methods?

This article does not provide a direct comparison between this technology and traditional methods in terms of efficiency, cost-effectiveness, or quality of the final product.

What are the specific industries or applications where this technology would have the most significant impact?

The article does not delve into the specific industries or applications where this technology could be most beneficial, leaving room for further exploration and analysis.


Original Abstract Submitted

the present disclosure is directed to an apparatus including a first laminating component configured to laminate a dry film onto a substrate using heat, and a focused cure module configured to selectively cure a first portion of the dry film without curing a second portion of the dry film. the first portion forms a perimeter that surrounds the second portion.

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