Intel corporation (20240162158). PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract

PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES

Organization Name

intel corporation

Inventor(s)

Brandon C. Marin of Gilbert AZ (US)

Gang Duan of Chandler AZ (US)

Jeremy Ecton of Gilbert AZ (US)

Sashi Shekhar Kandanur of Phoenix AZ (US)

Ravindranath Vithal Mahajan of Chandler AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Hiroki Tanaka of Gilbert AZ (US)

PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240162158 titled 'PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES

Simplified Explanation

The abstract describes a microelectronic assembly with an interposer containing two IC dies, one embedded in a dielectric material and the other coupled to the interposer. The second portion of the interposer includes a glass substrate with a channel, exposing a conductive pad that is connected to a circuit in one of the IC dies.

• Interposer with embedded IC dies:

 - The interposer consists of a first portion with an embedded IC die in a dielectric material.

• Glass substrate with channel:

 - The second portion of the interposer includes a glass substrate with a channel, exposing a conductive pad.

• Conductive pad connection:

 - The conductive pad exposed in the opening of the channel is coupled to a circuit in one of the IC dies.

Potential Applications

This technology could be applied in advanced microelectronic devices, such as high-performance computing systems, data centers, and telecommunications equipment.

Problems Solved

This technology solves the challenge of integrating multiple IC dies in a compact and efficient manner, improving overall performance and reliability of microelectronic assemblies.

Benefits

- Enhanced performance and reliability of microelectronic assemblies. - Compact design for space-efficient integration of multiple IC dies. - Improved signal transmission and connectivity between IC components.

Potential Commercial Applications

"Advanced Microelectronic Assembly Technology for High-Performance Computing Systems"

Possible Prior Art

There may be prior art related to interposer technologies for microelectronic assemblies, but specific examples are not provided in the abstract.

Unanswered Questions

How does the embedded IC die in the dielectric material affect the overall performance of the microelectronic assembly?

The embedded IC die in the dielectric material may impact thermal management, signal transmission, and overall reliability of the assembly.

What are the specific circuit connections between the conductive pad and the IC dies, and how do they contribute to the functionality of the microelectronic assembly?

The specific circuit connections between the conductive pad and the IC dies determine the communication pathways and data transfer capabilities within the assembly, influencing its overall performance and functionality.

Original Abstract Submitted

embodiments of a microelectronic assembly includes: an interposer comprising a first portion in contact along an interface with a second portion; a first integrated circuit (ic) die embedded in a dielectric material in the first portion of the interposer; and a second ic die coupled to the first portion of the interposer opposite to the second portion, wherein: the second portion comprises a glass substrate with a channel within the glass substrate, a portion of the channel has an opening at the interface, a conductive pad in the first portion is exposed in the opening, and the conductive pad is coupled to a circuit in at least one of the first ic die or the second ic die.