Intel corporation (20240162157). BUMPLESS HYBRID ORGANIC GLASS INTERPOSER simplified abstract
Contents
- 1 BUMPLESS HYBRID ORGANIC GLASS INTERPOSER
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BUMPLESS HYBRID ORGANIC GLASS INTERPOSER - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
BUMPLESS HYBRID ORGANIC GLASS INTERPOSER
Organization Name
Inventor(s)
Jeremy D. Ecton of Gilbert AZ (US)
Brandon Christian Marin of Gilbert AZ (US)
Aleksandar Aleksov of Chandler AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Haobo Chen of Chandler AZ (US)
BUMPLESS HYBRID ORGANIC GLASS INTERPOSER - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162157 titled 'BUMPLESS HYBRID ORGANIC GLASS INTERPOSER
Simplified Explanation
The abstract describes a patent application for a bumpless hybrid organic glass interposer, where high-density pattern routing layers are placed on a carrier separate from the organic substrate package and then attached to it to achieve electrical connections through a self-align dry etch process.
- High-density pattern (HDP) routing layers placed on a carrier separate from the organic substrate package
- HDP layers attached to the substrate package to achieve electrical connections
- Utilization of a self-align dry etch process through landing pads connected to the HDP routing
Potential Applications
The technology could be applied in various industries such as semiconductor manufacturing, electronics, and telecommunications for improved interconnection solutions.
Problems Solved
This innovation solves the problem of achieving electrical connections between high-density pattern routing layers and underlying routing layers of the substrate package in a bumpless and efficient manner.
Benefits
The benefits of this technology include improved electrical connections, reduced signal loss, enhanced performance, and increased reliability in electronic devices.
Potential Commercial Applications
The technology could be commercialized in the semiconductor industry for advanced packaging solutions, in the electronics sector for high-performance devices, and in the telecommunications field for improved connectivity.
Possible Prior Art
One possible prior art could be the use of traditional bump interposers for achieving electrical connections, which may not be as efficient or reliable as the bumpless hybrid organic glass interposer described in the patent application.
Unanswered Questions
What materials are used for the high-density pattern routing layers in the interposer?
The specific materials used for the HDP layers are not mentioned in the abstract. Further details on the materials could provide insights into the performance and compatibility of the interposer.
How does the self-align dry etch process work in achieving electrical connections?
The abstract briefly mentions the use of a self-align dry etch process, but the specific mechanism and steps involved are not elaborated. Understanding the process in more detail could help in assessing its efficiency and reliability.
Original Abstract Submitted
a bumpless hybrid organic glass interposer. one or more high density pattern (hdp) routing layers are placed on a functional, thin, carrier, separate from the intended organic substrate patch or package. the hdp layer(s) is/are then attached to the substrate package. the interposers achieve electrical connections between the hdp layer and underlying routing layer of the substrate package by utilizing a self-align dry etch process through landing pads connected to the hdp routing.
