Intel corporation (20240162141). SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES simplified abstract

SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES

Organization Name

intel corporation

Inventor(s)

Ehren Mannebach of Beaverton OR (US)

Aaron Lilak of Beaverton OR (US)

Hui Jae Yoo of Portland OR (US)

Patrick Morrow of Portland OR (US)

Anh Phan of Beaverton OR (US)

Willy Rachmady of Beaverton OR (US)

Cheng-Ying Huang of Portland OR (US)

Gilbert Dewey of Beaverton OR (US)

Rishabh Mehandru of Portland OR (US)

SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240162141 titled 'SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES

Simplified Explanation

The abstract of the patent application describes electronic systems with vias that have both horizontal and vertical portions to provide interconnects to stacked components.

• Electronic systems have vias with horizontal and vertical portions for interconnects to stacked components.
• The system includes a board, a package substrate, and a die with a stack of components.
• The via adjacent to the stack of components has a vertical and horizontal portion for connectivity.

Potential Applications

This technology could be applied in:

• High-density electronic devices
• Stacked component systems
• Miniaturized electronics

Problems Solved

This technology helps in:

• Improving connectivity in stacked components
• Enhancing signal transmission efficiency
• Reducing space requirements in electronic systems

Benefits

The benefits of this technology include:

• Increased performance in electronic systems
• Enhanced reliability of interconnects
• Greater design flexibility in stacked component configurations

Potential Commercial Applications

The potential commercial applications of this technology could be in:

• Consumer electronics
• Telecommunications equipment
• Automotive electronics

Possible Prior Art

One possible prior art for this technology could be the use of through-silicon vias (TSVs) in stacked die configurations.

=== What are the manufacturing processes involved in creating the vias with horizontal and vertical portions? The manufacturing processes involved in creating the vias with horizontal and vertical portions include specialized drilling and plating techniques to achieve the desired structure.

=== How does the presence of vias with both horizontal and vertical portions impact the overall performance of the electronic system? The presence of vias with both horizontal and vertical portions improves signal transmission efficiency, reduces signal interference, and enables higher density stacking of components in the electronic system.

Original Abstract Submitted

embodiments disclosed herein include electronic systems with vias that include a horizontal and vertical portion in order to provide interconnects to stacked components, and methods of forming such systems. in an embodiment, an electronic system comprises a board, a package substrate electrically coupled to the board, and a die electrically coupled to the package substrate. in an embodiment the die comprises a stack of components, and a via adjacent to the stack of components, wherein the via comprises a vertical portion and a horizontal portion.