Intel corporation (20240160585). SHARING MEMORY AND I/O SERVICES BETWEEN NODES simplified abstract

SHARING MEMORY AND I/O SERVICES BETWEEN NODES

Organization Name

intel corporation

Inventor(s)

Debendra Das Sharma of Saratoga CA (US)

Robert G. Blankenship of Tacoma WA (US)

Suresh S. Chittor of Portland OR (US)

Kenneth C. Creta of Gig Harbor WA (US)

Balint Fleischer of Groton MA (US)

Michelle C. Jen of Mountain View CA (US)

Mohan J. Kumar of Aloha OR (US)

Brian S. Morris of Santa Clara CA (US)

SHARING MEMORY AND I/O SERVICES BETWEEN NODES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240160585 titled 'SHARING MEMORY AND I/O SERVICES BETWEEN NODES

Simplified Explanation

The abstract describes a patent application for a die-to-die interconnect system that allows communication between two dies using different protocols.

• The first die has a port to connect to a second die over the interconnect.
• The port includes circuitry to implement the physical layer of the interconnect.
• Protocol identification data is sent to identify the protocol being used.
• Data of the identified protocol is then sent over the interconnect.
• Different protocols can be identified and used for communication.
• Flits of the second protocol are sent as data over the interconnect.

Potential Applications

This technology could be used in:

• High-performance computing systems
• Data centers
• Networking equipment

Problems Solved

• Efficient communication between dies using different protocols
• Flexibility in protocol selection for communication
• Improved data transfer speeds

Benefits

• Increased data transfer efficiency
• Enhanced performance in multi-die systems
• Scalability for future advancements

Potential Commercial Applications

"Die-to-Die Interconnect System for Multi-Protocol Communication"

Possible Prior Art

There may be prior art related to die-to-die interconnect systems or multi-protocol communication in the field of semiconductor technology.

Unanswered Questions

How does this technology impact power consumption in multi-die systems?

This article does not address the potential effects of this technology on power usage in systems utilizing the die-to-die interconnect.

Are there any limitations to the number of protocols that can be supported by this interconnect system?

The article does not specify if there is a limit to the number of protocols that can be identified and used for communication between dies.

Original Abstract Submitted

a first die has a port to couple the first die to a second die over a die-to-die interconnect. the port includes circuitry to implement a physical layer of the die-to-die interconnect, send first protocol identification data over the physical layer to identify a first protocol in a plurality of protocols, send first data over the interconnect to the second die, wherein the first data comprise data of the first protocol, send second protocol identification data over the physical layer to identify a different second protocol in the plurality of protocols, and send second data over the interconnect to the second die, wherein the second data comprise flits of the second protocol.