Intel corporation (20240134726). APPLICATION CONTROL OF POWER CONFIGURATION AND THERMAL CONFIGURATION OF INFORMATION SYSTEMS PLATFORM simplified abstract
Contents
- 1 APPLICATION CONTROL OF POWER CONFIGURATION AND THERMAL CONFIGURATION OF INFORMATION SYSTEMS PLATFORM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 APPLICATION CONTROL OF POWER CONFIGURATION AND THERMAL CONFIGURATION OF INFORMATION SYSTEMS PLATFORM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
APPLICATION CONTROL OF POWER CONFIGURATION AND THERMAL CONFIGURATION OF INFORMATION SYSTEMS PLATFORM
Organization Name
Inventor(s)
Akhilesh S. Thyagaturu of Ruskin FL (US)
Francesc Guim Bernat of Barcelona (ES)
Karthik Kumar of Chandler AZ (US)
Marek Piotrowski of Pepowo (PL)
APPLICATION CONTROL OF POWER CONFIGURATION AND THERMAL CONFIGURATION OF INFORMATION SYSTEMS PLATFORM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240134726 titled 'APPLICATION CONTROL OF POWER CONFIGURATION AND THERMAL CONFIGURATION OF INFORMATION SYSTEMS PLATFORM
Simplified Explanation
The patent application describes a method that involves invoking API functions to determine the cooling states of different cooling devices for various components of a hardware platform, orchestrating concurrent execution of multiple applications based on these cooling states, and sending commands to change cooling states as needed.
- The method involves invoking API functions to determine the current cooling states of different cooling devices for various components of a hardware platform.
- It orchestrates the concurrent execution of multiple applications based on the cooling states of the hardware platform.
- Commands are sent to change the cooling states of the cooling devices to prepare for the concurrent execution of multiple applications.
Potential Applications
This technology could be applied in data centers, server farms, and other large computing environments where multiple applications are running simultaneously and efficient cooling management is crucial.
Problems Solved
This technology solves the problem of inefficient cooling management in hardware platforms running multiple applications concurrently, which can lead to overheating and performance issues.
Benefits
The benefits of this technology include improved performance and reliability of hardware platforms, optimized cooling management, and enhanced overall system efficiency.
Potential Commercial Applications
Potential commercial applications of this technology include server management software, data center cooling systems, and hardware platform optimization tools.
Possible Prior Art
One possible prior art could be cooling management systems for individual components of a hardware platform, but the orchestration of concurrent applications based on cooling states may be a novel aspect of this technology.
Unanswered Questions
How does this technology impact energy efficiency in hardware platforms?
This article does not address the specific energy efficiency implications of the cooling management method described. Energy consumption is a critical factor in data centers and computing environments, so understanding how this technology affects energy usage would be important for potential users.
Are there any limitations to the scalability of this method for large-scale hardware platforms?
The article does not discuss any potential limitations or challenges in implementing this method on a large scale. Understanding the scalability of this technology and any constraints it may have when applied to extensive hardware platforms would be essential for organizations considering its adoption.
Original Abstract Submitted
a method is described. the method includes invoking one of more functions from a set of api functions that expose the current respective cooling states of different, respective cooling devices for different components of a hardware platform. the method includes orchestrating concurrent execution of multiple applications on the hardware platform in view of the current respective cooling states. the method includes, in order to prepare the hardware platform for the concurrent execution of the multiple applications, prior to the concurrent execution of the multiple applications, sending one or more commands to the hardware platform to change a cooling state of at least one of the cooling devices.
