Intel corporation (20240120305). PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS simplified abstract
Contents
- 1 PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS
Organization Name
Inventor(s)
Jeremy Ecton of Gilbert AZ (US)
Brandon C. Marin of Gilbert AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Mohammad Mamunur Rahman of Gilbert AZ (US)
PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120305 titled 'PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS
Simplified Explanation
The abstract of the patent application describes a microelectronic assembly with an integrated circuit (IC) die coupled to a package substrate using solder-based interconnects of different sizes, with insulative baffles between bond-pads on the substrate to prevent short circuits.
- The microelectronic assembly includes an IC die connected to a package substrate using solder interconnects of varying sizes.
- Bumps on the IC die and bond-pads on the substrate are coated with solder to facilitate the connection.
- The bumps on the IC die have a coating to prevent solder wicking, ensuring a reliable connection.
- Insulative baffles on the substrate prevent short circuits between the bond-pads.
Potential Applications
This technology could be applied in various microelectronic devices such as smartphones, tablets, and computers.
Problems Solved
This technology helps prevent short circuits and ensures a reliable connection between the IC die and the package substrate.
Benefits
The use of different-sized interconnects and insulative baffles improves the reliability and performance of the microelectronic assembly.
Potential Commercial Applications
This technology could be beneficial for semiconductor manufacturers looking to improve the quality and reliability of their products.
Possible Prior Art
One possible prior art could be the use of insulative materials in microelectronic assemblies to prevent short circuits.
Unanswered Questions
How does the coating on the bumps prevent solder wicking?
The coating on the bumps likely repels the solder, preventing it from spreading beyond the desired area and ensuring a clean connection.
What materials are commonly used for the insulative baffles in microelectronic assemblies?
Common materials used for insulative baffles include polymers, ceramics, and other non-conductive materials to prevent short circuits between bond-pads.
Original Abstract Submitted
embodiments of a microelectronic assembly includes: a package substrate and an integrated circuit (ic) die coupled to a surface of the package substrate by first interconnects and second interconnects, the first interconnects and the second interconnects comprising solder. the first interconnects are larger than the second interconnects, the first interconnects and the second interconnects further comprise bumps on the ic die and bond-pads on the surface of the package substrate, with the solder coupled to the bumps and the bond-pads, lateral sides of the bumps have a coating of a material that prevents solder wicking, and the surface of the package substrate includes insulative baffles between the bond-pads.
