Intel corporation (20240120302). Techniques For Arranging Conductive Pads In Electronic Devices simplified abstract
Contents
- 1 Techniques For Arranging Conductive Pads In Electronic Devices
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Techniques For Arranging Conductive Pads In Electronic Devices - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
Techniques For Arranging Conductive Pads In Electronic Devices
Organization Name
Inventor(s)
Krishna Bharath Kolluru of Portland OR (US)
Atul Maheshwari of Portland OR (US)
Mahesh Kumashikar of Bangalore (IN)
Md Altaf Hossain of Portland OR (US)
Ankireddy Nalamalpu of Portland OR (US)
Omkar Karhade of Chandler AZ (US)
Techniques For Arranging Conductive Pads In Electronic Devices - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120302 titled 'Techniques For Arranging Conductive Pads In Electronic Devices
Simplified Explanation
The abstract describes an electronic device with external conductive pads for routing signals.
- The electronic device has first and second external conductive pads for routing a first signal.
- Additionally, the device has third and fourth external conductive pads located between the first and second pads on its surface.
Potential Applications
The technology described in the patent application could be used in various electronic devices such as smartphones, tablets, laptops, and wearable technology.
Problems Solved
This technology helps in efficiently routing signals within electronic devices, reducing interference and improving overall performance.
Benefits
The benefits of this technology include improved signal routing, enhanced device performance, and potentially reduced manufacturing costs.
Potential Commercial Applications
The technology could be applied in the consumer electronics industry for the development of next-generation devices with improved signal routing capabilities.
Possible Prior Art
One possible prior art could be similar conductive pad configurations in electronic devices for signal routing purposes.
Unanswered Questions
How does the placement of the third and fourth external conductive pads impact signal routing efficiency?
The article does not delve into the specific details of how the placement of the third and fourth external conductive pads affects signal routing within the electronic device.
Are there any specific design considerations for integrating these external conductive pads into different types of electronic devices?
The article does not discuss any specific design considerations that need to be taken into account when integrating these external conductive pads into various electronic devices.
Original Abstract Submitted
an electronic device includes first and second external conductive pads coupled to route a first signal and third and fourth external conductive pads. the third and the fourth external conductive pads are between the first and the second external conductive pads on a surface of the electronic device.
