Intel corporation (20240113479). SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS simplified abstract
Contents
- 1 SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.9.1 Unanswered Questions
- 1.9.2 How does this technology compare to existing socket interconnect structures in terms of signal integrity and electromagnetic interference?
- 1.9.3 What are the potential manufacturing challenges associated with implementing this socket interconnect structure in mass production?
- 1.10 Original Abstract Submitted
SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS
Organization Name
Inventor(s)
Phil Geng of Washougal WA (US)
Carlos Alberto Lizalde Moreno of Guadalajara (MX)
Raul Enriquez Shibayama of Zapopan (MX)
Steven A. Klein of Chanlder AZ (US)
SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113479 titled 'SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS
Simplified Explanation
The patent application describes a socket interconnect structure that includes a housing with multiple openings, a ground structure coupled to the housing, ground pins, and signal pins.
- The housing has first and second openings, while the ground structure has third openings that align with the second openings when coupled to the housing.
- Ground pins are located in the second and third openings to electrically couple them, while signal pins are located in the first openings and are electrically isolated from the ground structure.
Potential Applications
The technology described in the patent application could be applied in various electronic devices that require reliable socket interconnect structures, such as computer motherboards, networking equipment, and industrial control systems.
Problems Solved
This technology solves the problem of ensuring proper electrical connections between ground pins and signal pins in socket interconnect structures, which is crucial for the functionality and performance of electronic devices.
Benefits
The benefits of this technology include improved signal integrity, reduced electromagnetic interference, and enhanced overall reliability of electronic devices utilizing socket interconnect structures.
Potential Commercial Applications
The technology could be commercially applied in the manufacturing of electronic components, telecommunications equipment, and consumer electronics to enhance their performance and reliability.
Possible Prior Art
One possible prior art for this technology could be existing socket interconnect structures used in electronic devices, which may not provide the same level of electrical coupling and isolation as described in the patent application.
Unanswered Questions
How does this technology compare to existing socket interconnect structures in terms of signal integrity and electromagnetic interference?
The patent application does not provide a direct comparison with existing socket interconnect structures in terms of signal integrity and electromagnetic interference. Further testing and analysis would be needed to determine the specific advantages of this technology in these areas.
What are the potential manufacturing challenges associated with implementing this socket interconnect structure in mass production?
The patent application does not address potential manufacturing challenges associated with implementing this socket interconnect structure in mass production. Factors such as cost, scalability, and compatibility with existing manufacturing processes would need to be considered in further development and commercialization of the technology.
Original Abstract Submitted
methods, apparatus, systems, and articles of manufacture are disclosed for socket interconnect structures and related methods. an example socket interconnect apparatus includes a housing defining a plurality of first openings and a plurality of second openings and a ground structure coupled to the housing. the ground structure defines a plurality of third openings. the third openings of the ground structure align with the second openings of the housing when the ground structure is coupled to the housing. a plurality of ground pins are located in respective ones of the second openings and third openings. the ground structure is to electrically couple the ground pins. a plurality of signal pins are located in respective ones of the first openings of the housing. the signal pins are electrically isolated from the ground structure.
