Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract

MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE

Organization Name

intel corporation

Inventor(s)

Jeremy Ecton of Gilbert AZ (US)

Brandon Marin of Gilbert AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240113075 titled 'MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE

Simplified Explanation

The patent application describes multi-die packages with a glass substrate between adjacent IC dies, allowing for electrical interconnection and planarization of the components. Here are some key points from the abstract:

• Glass substrate used in multi-die packages
• IC dies placed within recesses in the glass substrate
• Conductive vias extend through the glass substrate
• Organic package dielectric material built up on both sides of IC dies and glass substrate
• Metallization features within package dielectric material electrically interconnect IC dies
• Package interconnect interfaces further coupled to a host with solder interconnects
• Metallization features on second side of IC dies interconnect the dies

Potential Applications

This technology could be applied in various electronic devices such as smartphones, tablets, and computers to improve performance and reliability.

Problems Solved

This innovation solves the problem of efficiently interconnecting multiple IC dies within a compact package while ensuring proper electrical connections and planarization.

Benefits

The benefits of this technology include increased integration density, improved electrical performance, enhanced reliability, and potentially reduced manufacturing costs.

Potential Commercial Applications

Potential commercial applications of this technology include semiconductor packaging, consumer electronics, automotive electronics, and industrial automation.

Possible Prior Art

One possible prior art in this field is the use of multi-chip modules (MCMs) in electronic devices, which also involve integrating multiple IC dies within a single package for improved performance and functionality.

Unanswered Questions

1. How does the use of a glass substrate in multi-die packages impact the overall reliability of the electronic device? 2. Are there any limitations or challenges associated with the planarization process of the IC dies and glass substrate within the package?

Original Abstract Submitted

multi-die packages including a glass substrate within a space between adjacent ic dies. two or more ic die may be placed within recesses formed in a glass substrate. the ic die and glass substrate, along with any conductive vias extending through the glass substrate may be planarized. organic package dielectric material may then be built up on both sides of the ic dies and glass substrate. metallization features formed within package dielectric material built up on a first side of the ic die may electrically interconnect the ic dies to package interconnect interfaces that may be further coupled to a host with solder interconnects. metallization features formed within package dielectric material built up on a second side of the first and second ic dies may electrically interconnect the first ic die to the second ic die.