Intel corporation (20240113047). INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS simplified abstract
Contents
- 1 INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS
Organization Name
Inventor(s)
Srinivasan Raman of Chandler AZ (US)
Brandon C. Marin of Gilbert AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
Benjamin Duong of Phoenix AZ (US)
Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)
Kripa Chauhan of Santa Clara CA (US)
INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113047 titled 'INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS
Simplified Explanation
The abstract describes a semiconductor assembly with embedded components in glass core layers. Here is a simplified explanation of the patent application:
- Glass core layers in semiconductor assemblies have embedded components.
- The glass core has cavities where components are embedded.
- Components are at least partially embedded in the glass core.
- A semiconductor die is attached to the substrate.
Potential Applications
The technology can be applied in:
- Semiconductor manufacturing
- Electronics industry
- Automotive sector
Problems Solved
- Enhanced durability and reliability of semiconductor assemblies
- Improved thermal management
- Increased integration density
Benefits
- Better performance and longevity of semiconductor devices
- Reduced risk of component damage
- Enhanced overall system efficiency
Potential Commercial Applications
- Consumer electronics
- Telecommunications
- Aerospace industry
Possible Prior Art
One possible prior art could be the use of traditional substrates and packaging methods in semiconductor assemblies.
Unanswered Questions
How does the embedded components affect the overall cost of manufacturing semiconductor assemblies?
The article does not provide information on the cost implications of using embedded components in glass core layers.
What are the specific materials used for the glass core layers and embedded components?
The article does not detail the specific materials used in the glass core layers and embedded components.
Original Abstract Submitted
various embodiments disclosed relate to embedded components in glass core layers for semiconductor assemblies. the present disclosure includes a semiconductor assembly with a glass core having one or more cavities and a component embedded into the glass core at the one or more cavities portion, the component at least partially embedded in the glass core, and a semiconductor die attached to the substrate.
