Intel corporation (20240113046). EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS simplified abstract

EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS

Organization Name

intel corporation

Inventor(s)

Jason Scott Steill of Phoenix AZ (US)

Shayan Kaviani of Phoenix AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Benjamin Duong of Phoenix AZ (US)

Srinivasan Raman of Chandler AZ (US)

Yi Yang of Gilbert AZ (US)

EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240113046 titled 'EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS

Simplified Explanation

The patent application relates to embedding components in glass core layers for semiconductor assemblies. The semiconductor assembly includes a glass core with one or more cavities, where a component is embedded into the glass core at the cavities portion, at least partially. A semiconductor die is attached to the substrate.

• Glass core layers with embedded components for semiconductor assemblies
• Components embedded in glass core at cavities portion
• Semiconductor die attached to the substrate

Potential Applications

The technology could be applied in the manufacturing of advanced semiconductor assemblies, such as microprocessors, memory chips, and sensors.

Problems Solved

1. Enhanced integration of components in semiconductor assemblies. 2. Improved thermal management due to the use of glass core layers.

Benefits

1. Increased reliability and durability of semiconductor assemblies. 2. Better performance and efficiency in electronic devices. 3. Cost-effective manufacturing processes.

Potential Commercial Applications

Optimizing Glass Core Layers for Semiconductor Assemblies

Possible Prior Art

There are existing patents related to embedding components in various materials for semiconductor assemblies, but specific prior art related to embedding components in glass core layers is not readily available.

How does the technology impact the overall size of semiconductor assemblies?

The article does not provide information on whether embedding components in glass core layers affects the size of semiconductor assemblies.

What are the potential challenges in mass-producing semiconductor assemblies with embedded components in glass core layers?

The article does not address the potential challenges that may arise in large-scale production of semiconductor assemblies with embedded components in glass core layers.

Original Abstract Submitted

various embodiments disclosed relate to embedded components in glass core layers for semiconductor assemblies. the present disclosure includes a semiconductor assembly with a glass core having one or more cavities and a component embedded into the glass core at the one or more cavities portion, the component at least partially embedded in the glass core, and a semiconductor die attached to the substrate.