Intel corporation (20240113039). BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS DURING WAFER CHUCKING simplified abstract
Contents
- 1 BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS DURING WAFER CHUCKING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS DURING WAFER CHUCKING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS DURING WAFER CHUCKING
Organization Name
Inventor(s)
Tayseer Mahdi of Hillsboro OR (US)
Grant Kloster of Lake Oswego OR (US)
Florian Gstrein of Portland OR (US)
BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS DURING WAFER CHUCKING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113039 titled 'BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS DURING WAFER CHUCKING
Simplified Explanation
The abstract describes methods, device structures, and wafer treatment chemistries related to backside wafer treatments to reduce distortions and overlay errors due to wafer deformation during wafer chucking. A backside layer is applied to the wafer prior to chucking, and the chemistry of the backside layer lowers the surface free energy of the wafer during chucking to eliminate or mitigate wafer deformation during wafer processing.
- Backside layer applied to wafer prior to chucking
- Chemistry of backside layer lowers surface free energy of wafer during chucking
- Eliminates or mitigates wafer deformation during wafer processing
Potential Applications
This technology could be applied in semiconductor manufacturing, photolithography, and other industries where precise wafer alignment and processing are critical.
Problems Solved
This technology addresses distortions and overlay errors caused by wafer deformation during chucking, improving the accuracy and quality of wafer processing.
Benefits
The use of backside wafer treatments can lead to higher yields, improved device performance, and reduced manufacturing costs in the semiconductor industry.
Potential Commercial Applications
"Improving Wafer Chucking with Backside Treatments: Applications in Semiconductor Manufacturing"
Possible Prior Art
Prior art may include methods for reducing wafer deformation during processing, such as the use of specialized chucking techniques or materials.
Unanswered Questions
How does the backside layer chemistry specifically lower the surface free energy of the wafer during chucking?
The abstract mentions that the chemistry of the backside layer lowers the surface free energy of the wafer, but it does not provide specific details on the mechanisms or compounds involved in this process.
What are the specific types of distortions and overlay errors that can be reduced or eliminated by this technology?
While the abstract mentions distortions and overlay errors as problems addressed by the technology, it does not specify the exact nature or extent of these issues that can be mitigated.
Original Abstract Submitted
methods, device structures, and wafer treatment chemistries related to backside wafer treatments to reduce distortions and overlay errors due to wafer deformation during wafer chucking are described. a backside layer is applied to the wafer prior to chucking. the chemistry of the backside layer lowers the surface free energy of the wafer during chucking to eliminate or mitigate wafer deformation during wafer processing.
