Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract
Contents
- 1 MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE
Organization Name
Inventor(s)
Jeremy Ecton of Gilbert AZ (US)
Brandon Marin of Gilbert AZ (US)
Srinivas Pietambaram of Chandler AZ (US)
Hiroki Tanaka of Gilbert AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113029 titled 'MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE
Simplified Explanation
The patent application describes multi-die packages with at least one glass substrate between two adjacent IC dies or surrounding an interconnect bridge die. The IC dies may be placed within recesses in the glass substrate, and conductive vias may extend through the glass substrate. The bridge die can be directly bonded or soldered to the adjacent IC dies for fine pitch interconnect. Metallization features on the second side of the glass substrate electrically interconnect the IC dies to package interconnect interfaces.
- Glass substrate used in multi-die packages
- IC dies placed within recesses in the glass substrate
- Conductive vias extend through the glass substrate
- Bridge die directly bonded or soldered to adjacent IC dies
- Metallization features on the glass substrate for interconnect
Potential Applications
The technology can be applied in:
- High-performance computing
- Telecommunications
- Automotive electronics
Problems Solved
The technology addresses:
- Fine pitch interconnect challenges
- Space constraints in multi-die packages
- Improved electrical connectivity
Benefits
The benefits of this technology include:
- Enhanced performance
- Increased reliability
- Space-saving design
Potential Commercial Applications
This technology can be utilized in:
- Data centers
- Mobile devices
- Automotive electronics
Possible Prior Art
One possible prior art is the use of silicon substrates in multi-die packages for interconnect purposes.
Unanswered Questions
How does the planarization process impact the overall package performance?
The planarization process ensures a flat surface for bonding and interconnects, but its effect on electrical properties and reliability needs further investigation.
What are the environmental implications of using glass substrates in electronic packaging?
The environmental impact of glass substrates, including recycling and disposal considerations, is an area that requires more research and analysis.
Original Abstract Submitted
multi-die packages including at least one glass substrate within a space between two adjacent ic dies or surrounding an interconnect bridge die. the various ic dies may be placed within recesses formed in the glass substrate. the ic die and glass substrate, along with any conductive vias extending through the glass substrate may be planarized. the bridge die may be directly bonded or soldered to the adjacent ic dies, providing fine pitch interconnect. the opposite side of the adjacent ic dies and glass substrate may be attached to a host component or may be built up with package dielectric material. metallization features formed on the second side of the glass substrate may electrically interconnect the ic dies to package interconnect interfaces that may be further coupled to a host with solder interconnects.
