Intel corporation (20240113009). POROUS POLYMER DIELECTRIC LAYER ON CORE simplified abstract
Contents
- 1 POROUS POLYMER DIELECTRIC LAYER ON CORE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POROUS POLYMER DIELECTRIC LAYER ON CORE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
POROUS POLYMER DIELECTRIC LAYER ON CORE
Organization Name
Inventor(s)
Whitney Bryks of Tempe AZ (US)
Aaditya Candadai of Chandler AZ (US)
Dilan Seneviratne of Phoenix AZ (US)
Junxin Wang of Gilbert AZ (US)
Peumie Abeyratne Kuragama of Chandler AZ (US)
POROUS POLYMER DIELECTRIC LAYER ON CORE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113009 titled 'POROUS POLYMER DIELECTRIC LAYER ON CORE
Simplified Explanation
The patent application describes an electronic device with an interposer, a porous polymer layer, and one or more dies connected to the interposer via a metallic through via.
- The electronic device includes an interposer with a metallic through via extending from one surface to another.
- A first porous polymer layer is adjacent to the interposer's surface.
- One or more dies are coupled to the first porous polymer layer and connected to the metallic through via.
Potential Applications
This technology could be applied in:
- Advanced electronic devices
- High-performance computing systems
- Aerospace and defense systems
Problems Solved
This technology addresses:
- Enhanced thermal management
- Improved electrical connectivity
- Increased reliability and durability of electronic devices
Benefits
The benefits of this technology include:
- Better heat dissipation
- Higher performance capabilities
- Longer lifespan of electronic devices
Potential Commercial Applications
The potential commercial applications of this technology could be seen in:
- Consumer electronics
- Telecommunications equipment
- Automotive electronics
Possible Prior Art
One possible prior art for this technology could be:
- Existing interposer technologies with traditional polymer layers and die connections.
Unanswered Questions
How does this technology compare to existing interposer designs in terms of cost-effectiveness?
This article does not provide information on the cost implications of implementing this technology compared to traditional interposer designs.
What are the specific industries that would benefit the most from this technology?
The article does not specify which industries would see the greatest advantages from adopting this technology.
Original Abstract Submitted
an electronic device can include an interposer, a first porous polymer layer, and one or more die. the interposer can include a metallic through via extending from a first surface of the interposer to a second surface of the interposer. the first polymer layer can be adjacent to the first surface of the interposer. the one or more dies can be coupled to the first porous polymer layer and connected to the metallic through via.
