Intel corporation (20240113006). PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract

PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER

Organization Name

intel corporation

Inventor(s)

Brandon C. Marin of Gilbert AZ (US)

Gang Duan of Chandler AZ (US)

Jeremy Ecton of Gilbert AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240113006 titled 'PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER

Simplified Explanation

The patent application describes a microelectronic assembly comprising an interposer structure of glass, a substrate with organic dielectric material, and multiple IC dies connected in a specific configuration.

• The interposer structure is made of glass.
• The substrate contains organic dielectric material and is connected to one side of the interposer structure.
• The IC dies are connected in a specific arrangement:

 * The first IC die is connected to the substrate with first interconnects.
 * The second IC die is embedded in the organic dielectric material of the substrate and connected to the first IC die with second interconnects.
 * The second IC die is also connected to the first side of the interposer structure with third interconnects.
 * The third IC die is connected to the second side of the interposer structure with fourth interconnects.

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1. 1. 1. Potential Applications

• High-performance computing
• Data centers
• Telecommunications

1. 1. 1. Problems Solved

• Improved thermal performance
• Enhanced electrical connectivity
• Increased integration density

1. 1. 1. Benefits

• Higher reliability
• Better signal integrity
• Enhanced overall performance

1. 1. 1. Potential Commercial Applications
         1. Advanced Microelectronics for Next-Generation Devices

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1. 1. 1. 1. Prior Art

There is prior art in the field of microelectronic assemblies, including various methods of interconnecting IC dies and substrates. However, the specific configuration described in this patent application may be novel and inventive.

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1. 1. 1. Unanswered Questions

1. 1. 1. 1. How does this microelectronic assembly compare to traditional methods in terms of cost-effectiveness?

The article does not provide information on the cost implications of implementing this technology compared to existing methods.

1. 1. 1. 1. What are the environmental impacts of using glass and organic dielectric material in microelectronic assemblies?

The potential environmental benefits or drawbacks of using these materials are not addressed in the article.

Original Abstract Submitted

embodiments of a microelectronic assembly comprise: an interposer structure of glass, a substrate comprising organic dielectric material, the substrate coupled to a first side of the interposer structure; and a plurality of ic dies. a first ic die in the plurality of ic dies is coupled to the substrate by first interconnects, a second ic die in the plurality of ic dies is embedded in the organic dielectric material of the substrate, the second ic die is coupled to the first ic die by second interconnects, the second ic die is coupled to the first side of the interposer structure by third interconnects, and a third ic die in the plurality of ic dies is coupled to a second side of the interposer structure by fourth interconnects, the second side of the interposer structure being opposite the first side of the interposer structure.