Intel corporation (20240112972). MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract

MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER

Organization Name

intel corporation

Inventor(s)

Hiroki Tanaka of Gilbert AZ (US)

Robert Alan May of Chandler AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Brandon C. Marin of Gilbert AZ (US)

Jeremy D. Ecton of Gilbert AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Changhua Liu of Chandler AZ (US)

MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240112972 titled 'MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER

Simplified Explanation

The patent application describes microelectronics package architectures utilizing photo-integrated glass interposers and photonic integrated glass layers.

• The microelectronics packages consist of an organic substrate, a photonic integrated glass layer, and a glass interposer.
• The organic substrate includes through substrate vias for connectivity.
• The photonic integrated glass layer, which may have photo detectors, is attached to the organic substrate.
• The glass interposer, which defines through glass vias, is also attached to the organic substrate for optical communication with the photo detectors.

Potential Applications

This technology could be applied in:

• High-speed data communication systems
• Optical sensors for various industries

Problems Solved

This technology addresses:

• Improved signal transmission and data processing capabilities
• Enhanced optical communication within microelectronics packages

Benefits

The benefits of this technology include:

• Higher data transfer speeds
• Improved reliability and performance of microelectronics packages

Potential Commercial Applications

This technology has potential in:

• Telecommunications industry for high-speed data transmission
• Aerospace industry for optical sensors and communication systems

Possible Prior Art

One possible prior art could be the use of traditional interposers and substrates in microelectronics packaging.

Unanswered Questions

1. How does the integration of glass layers improve the performance of microelectronics packages? 2. What are the specific manufacturing methods used to create these photo-integrated glass interposers and photonic integrated glass layers?

Original Abstract Submitted

disclosed herein are microelectronics package architectures utilizing photo-integrated glass interposers and photonic integrated glass layers and methods of manufacturing the same. the microelectronics packages may include an organic substrate, a photonic integrated glass layer, and a glass interpose. the organic substrate may define through substrate vias. the photonic integrated glass layer may be attached to the organic substrate. the photonic integrated glass layer may include photo detectors. the glass interposer may be attached to the organic substrate. the glass interposer may define through glass vias in optical communication with the photo detectors.