Intel corporation (20240105655). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT simplified abstract
Contents
- 1 MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT
Organization Name
Inventor(s)
Brandon C. Marin of Gilbert AZ (US)
Kristof Kuwawi Darmawikarta of Chandler AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
Jeremy Ecton of Gilbert AZ (US)
MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105655 titled 'MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT
Simplified Explanation
The patent application describes a microelectronic assembly with a conductive pad, a conductive via, a microelectronic component, an interconnect, and a liner.
- The microelectronic assembly includes a conductive pad with a first surface and an opposing second surface.
- A conductive via is coupled to the first surface of the conductive pad.
- The microelectronic component has a conductive contact that is electrically coupled to the second surface of the conductive pad via an interconnect made of nickel or tin.
- A liner made of nickel, palladium, or gold is placed between the interconnect and the second surface of the conductive pad.
- In some embodiments, the bottom surface of the liner is curved outward towards the conductive pad, and the liner may also be on side surfaces of the interconnect.
Potential Applications
The technology described in the patent application could be used in various microelectronic devices, such as smartphones, tablets, laptops, and other electronic gadgets.
Problems Solved
This technology helps improve the electrical connectivity and reliability of microelectronic assemblies by using specific materials and configurations for the conductive pad, via, interconnect, and liner.
Benefits
The use of nickel, tin, palladium, and gold in the assembly enhances the performance and durability of microelectronic components, leading to more reliable electronic devices.
Potential Commercial Applications
"Enhancing Microelectronic Assembly Reliability with Nickel, Tin, Palladium, and Gold Materials"
Possible Prior Art
There may be prior art related to microelectronic assemblies using different materials and configurations for interconnects and liners. Further research is needed to identify specific examples.
Unanswered Questions
How does this technology compare to existing microelectronic assembly methods in terms of cost-effectiveness and performance?
The patent application does not provide information on the cost-effectiveness of implementing this technology compared to existing methods. Further analysis and testing would be needed to determine the cost implications and performance benefits of this innovation.
What are the potential environmental impacts of using nickel, palladium, and gold in microelectronic assemblies?
The patent application does not address the potential environmental impacts of using materials like nickel, palladium, and gold in microelectronic assemblies. A comprehensive life cycle assessment would be necessary to evaluate the environmental footprint of this technology.
Original Abstract Submitted
microelectronic assemblies, related devices and methods, are disclosed herein. in some embodiments, a microelectronic assembly may include a conductive pad having a first surface and an opposing second surface; a conductive via coupled to the first surface of the conductive pad; a microelectronic component having a conductive contact, the conductive contact of the microelectronic component electrically coupled, by an interconnect, to the second surface of the conductive pad, wherein a material of the interconnect includes nickel or tin; and a liner between the interconnect and the second surface of the conductive pad, and wherein a material of the liner includes nickel, palladium, or gold. in some embodiments, a bottom surface of the liner is curved outward towards the conductive pad. in some embodiments, the liner also may be on side surfaces of the interconnect.
