Intel corporation (20240105596). INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS simplified abstract

INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS

Organization Name

intel corporation

Inventor(s)

Abhishek A. Sharma of Hillsboro OR (US)

Tahir Ghani of Portland OR (US)

Wilfred Gomes of Portland OR (US)

Anand S. Murthy of Portland OR (US)

Shem Ogadhoh of West Linn OR (US)

Pushkar Sharad Ranade of San Jose CA (US)

Sagar Suthram of Portland OR (US)

Elliot Tan of Portland OR (US)

INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240105596 titled 'INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS

Simplified Explanation

An interconnect, specifically a trench or line interconnect, is referred to as an “angled interconnect” if the interconnect is neither perpendicular nor parallel to any edges of front or back faces of the support structure, or if the interconnect is not parallel or perpendicular to interconnect in another region of an interconnect layer. Angled interconnects may be used to decrease the area of pitch transition regions. Angled interconnects may also be used to decrease the area of pitch offset regions.

• Angled interconnects are interconnects that are not perpendicular or parallel to any edges of the support structure.
• These interconnects can help reduce the area of pitch transition regions.
• They can also decrease the area of pitch offset regions.

Potential Applications

The technology of angled interconnects can be applied in the following areas:

• Semiconductor manufacturing
• Integrated circuit design
• Microelectronics

Problems Solved

The technology of angled interconnects helps solve the following issues:

• Reducing the area of pitch transition regions
• Decreasing the area of pitch offset regions
• Improving the efficiency of interconnect layouts

Benefits

The benefits of using angled interconnects include:

• Increased density of interconnects
• Enhanced performance of integrated circuits
• Improved overall functionality of semiconductor devices

Potential Commercial Applications

The potential commercial applications of angled interconnect technology include:

• Advanced microprocessors
• Memory devices
• Communication systems

Possible Prior Art

One possible prior art related to angled interconnects is the use of angled vias in semiconductor devices to improve signal routing efficiency.

How do angled interconnects impact the overall power consumption of semiconductor devices?

Angled interconnects can potentially reduce the power consumption of semiconductor devices by optimizing signal routing paths and minimizing signal delays.

What are the challenges associated with implementing angled interconnects in large-scale integrated circuits?

One challenge could be the complexity of design and manufacturing processes when incorporating angled interconnects in densely packed integrated circuits. Additional research and development may be required to address these challenges effectively.

Original Abstract Submitted

ic devices with angled interconnects are disclosed herein. an interconnect, specifically a trench or line interconnect, is referred to as an “angled interconnect” if the interconnect is neither perpendicular nor parallel to any edges of front or back faces of the support structure, or if the interconnect is not parallel or perpendicular to interconnect in another region of an interconnect layer. angled interconnects may be used to decrease the area of pitch transition regions. angled interconnects may also be used to decrease the area of pitch offset regions.