Intel corporation (20240101413). SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES simplified abstract

SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES

Organization Name

intel corporation

Inventor(s)

Jeremy D. Ecton of Gilbert AZ (US)

Brandon C. Marin of Gilbert AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Oladeji Fadayomi of Maricopa AZ (US)

Oscar Ojeda of Chandler AZ (US)

SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240101413 titled 'SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES

Simplified Explanation

The patent application describes microelectronics package architectures with self-aligned air gaps and methods of manufacturing them. The packages consist of first and second substrates, first and second traces, and a photosensitive material. The first trace is attached to the first substrate with a first sidewall, while the second trace is also attached to the first substrate with a second sidewall. The second trace is spaced from the first trace, with the second sidewall facing the first sidewall. Portions of the photosensitive material are attached to the first and second sidewalls, and the second substrate is attached to the first and second traces, forming the air gap between them.

• Microelectronics package architectures with self-aligned air gaps
• Method of manufacturing microelectronics packages with self-aligned air gaps
• Use of photosensitive material to create air gaps
• Utilization of first and second substrates and traces in forming the air gap

Potential Applications

The technology can be applied in:

• Semiconductor manufacturing
• Integrated circuits
• Microprocessors
• Sensors

Problems Solved

• Improved insulation between traces
• Enhanced performance and reliability of microelectronics packages
• Reduction of crosstalk and interference

Benefits

• Increased efficiency of microelectronics components
• Enhanced signal integrity
• Miniaturization of electronic devices

Potential Commercial Applications

• Electronics industry
• Telecommunications sector
• Automotive electronics
• Consumer electronics

Possible Prior Art

One possible prior art could be the use of sacrificial materials to create air gaps in microelectronics packages.

How does the photosensitive material contribute to the formation of air gaps in the microelectronics packages?

The photosensitive material plays a crucial role in creating the air gaps by attaching to the sidewalls of the traces and substrates. However, the specific mechanism of how this material enables the formation of the air gaps is not detailed in the abstract.

What are the specific dimensions and materials used in the manufacturing process of these microelectronics packages?

The abstract does not provide information on the exact dimensions or materials utilized in the manufacturing process, which could be crucial for understanding the practical implementation of this technology.

Original Abstract Submitted

disclosed herein are microelectronics package architectures having self-aligned air gaps and methods of manufacturing the same. the microelectronics packages may include first and second substrates, first and second traces, and a photosensitive material. the first trace may be attached to the first substrate and comprise a first sidewall. the second trace may be attached to the first substrate and comprise a second sidewall. the second traced may be spaced a distance from the first trace with the second sidewall facing the first sidewall. first and second portions of the photosensitive material may be attached to the first and second sidewalls, respectively. the second substrate may be attached to the first and second traces. the first and second substrates and the first and second traces may form the air gap in between the first and second traces.