Intel Corporation patent applications published on September 19th, 2024

Summary of the patent applications from Intel Corporation on September 19th, 2024

1. **Summary**: Intel Corporation has recently filed patents for innovative technologies related to cooling electronic devices, immersion cooling systems, and small data transmission in 5G NR networks. These patents focus on improving cooling efficiency, managing liquid coolant overflow, enhancing signal integrity, and addressing radio link failures during data transmissions. The immersion cooling system includes an apparatus with an immersion bath chamber, a transfer member for cooling pluggable units, and an overflow chamber with a valve for fluid flow control. The PCB shielding patent describes a multi-layer shield for protection against signal interference and EMI/RFI shielding. The cooling electronic devices patent introduces a dual cooling plate system for efficient heat dissipation. The small data transmission patent addresses radio link failures during data transmissions in 5G networks.

2. **Key Points of Patents**:

  * Immersion Cooling System:
    - Apparatus with immersion bath chamber and cover.
    - Transfer member for cooling pluggable units.
    - Overflow chamber with valve for fluid flow control.
  * PCB Shielding:
    - Multi-layer shield for signal protection.
    - Metallic layer with conductive adhesive.
    - Base layer for insulation.
  * Cooling Electronic Devices:
    - Dual cooling plate system for heat dissipation.
    - Fluidic coupling between cooling plates.
  * Small Data Transmission in 5G NR Networks:
    - Method for handling radio link failures during data transmissions.
    - Generation of secure keys for enhanced security.

3. **Notable Applications**:

  - Cooling electronic components in data centers and industrial machinery.
  - Managing liquid coolant overflow in industrial processes.
  - Improving signal integrity in electronics manufacturing.
  - Reliable small data transmission in IoT devices, smart cities, and industrial automation.

Patent applications for Intel Corporation on September 19th, 2024

METHODOLOGY TO ENABLE HIGHLY RESPONSIVE GAMEPLAY IN CLOUD AND CLIENT GAMING (18478201)

Main Inventor

Selvakumar Panneer

HINGES FOR ELECTRONIC DEVICES (18185505)

Main Inventor

Jeffrey Ho

CONTROLLING A POWER CONSUMPTION OF CIRCUITRY (18575238)

Main Inventor

Nikos KABURLASOS

COMMUTATIVE 1ULP HARDWARE MULTIPLIER (18325755)

Main Inventor

Theo Alan Drane

DEVICE, METHOD AND SYSTEM FOR PRIORITIZING ENTRIES OF AN INSTRUCTION FETCH RESOURCE (18120929)

Main Inventor

Gilles Pokam

SECURE ERROR CORRECTING CODE (ECC) TRUST EXECUTION ENVIRONMENT (TEE) CONFIGURATION METADATA ENCODING (18676811)

Main Inventor

David M. Durham

MEMORY ADDRESSING FOR ARBITRARY ENABLEMENT OR DISABLEMENT OF MEMORY RESOURCES (18477776)

Main Inventor

Guadalupe J. Garcia

CONFIGURATION INDEPENDENT SURFACE LAYOUT FOR DATA PROCESSING (18477888)

Main Inventor

Guadalupe J. Garcia

APPARATUS AND METHOD FOR REDUCED POWER TLB MANAGEMENT (18121972)

Main Inventor

Jason BRANDT

ON-ON-PACKAGE DIE-TO-DIE (D2D) INTERCONNECT FOR MEMORY USING UNIVERSAL CHIPLET INTERCONNECT EXPRESS (UCIE) PHY (18399463)

Main Inventor

Debendra Das Sharma

Systems And Methods For Generating Redacted Circuit Designs For Integrated Circuits (18120857)

Main Inventor

David Kehlet

TIME BASED FRAME GENERATION VIA A TEMPORALLY AWARE MACHINE LEARNING MODEL (18478233)

Main Inventor

Selvakumar Panneer

DYNAMIC GPU FRAME GENERATION AND READ/WRITE SCALING USING COMMAND BUFFER PREDICATION (18478286)

Main Inventor

Selvakumar Panneer

HARDWARE-EFFICIENT NEURAL FRAME PREDICTION WITH LOW RESOLUTION OPTICAL FLOW (18308725)

Main Inventor

Darshan R. Iyer

OPTICAL FLOW GENERATION USING RASTERIZED TRIANGLE ID BUFFERS (18478271)

Main Inventor

Selvakumar Panneer

LEVEL-OF-DETAIL DETERMINATION USING MAJOR SQUARED AND EFFICIENT CLAMPING IN A GRAPHICS ENVIRONMENT (18346141)

Main Inventor

William ZORN

HUMAN-ROBOT COLLABORATION FOR 3D FUNCTIONAL MAPPING (18373573)

Main Inventor

David Gonzalez Aguirre

ENHANCED TECHNIQUES FOR REAL-TIME MULTI-PERSON THREE-DIMENSIONAL POSE TRACKING USING A SINGLE CAMERA (18569996)

Main Inventor

Shandong WANG

PRESERVING G-BUFFER & OPTICAL FLOW IN UV SPACE (18478229)

Main Inventor

Selvakumar Panneer

LEVEL-OF-DETAIL EIGENVECTOR DETERMINATION IN A GRAPHICS ENVIRONMENT (18346136)

Main Inventor

William ZORN

OPTICAL FLOW MIP ADJUSTMENT FOR RENDERING AND ENCODING (18478243)

Main Inventor

Selvakumar Panneer

UV SPACE RENDERING AND AI PROCESSING (18607243)

Main Inventor

Selvakumar Panneer

SYSTEMS, APPARATUS, ARTICLES OF MANUFACTURE, AND METHODS FOR LOCATION-AWARE VIRTUAL REALITY (18571146)

Main Inventor

Stephen PALERMO

APPARATUS AND METHOD FOR DYNAMIC QUADRUPLE CONVOLUTION IN 3D CNN (18565967)

Main Inventor

Dongqi CAI

EMBOSSED INDUCTOR DESIGN FOR MOTHERBOARD VOLTAGE REGULATORS TO INCREASE OVERALL SYSTEM POWER DENSITY (18120761)

Main Inventor

Ashish SHARMA

KEYBOARDS FOR ELECTRONIC DEVICES WITH KEYS HAVING INTEGRATED SPEAKERS (18185460)

Main Inventor

Abhishek Srivastav

DEVICE AND METHOD FOR REAL-TIME OFFSET ADJUSTMENT OF A SEMICONDUCTOR DIE PLACEMENT (18185427)

Main Inventor

Hong Seung YEON

VIA STRUCTURES IN BONDED GLASS SUBSTRATES (18121331)

Main Inventor

Sashi S. KANDANUR

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE (18182879)

Main Inventor

Kyle Arrington

MICROFLUIDIC COOLING IN INTEGRATED CIRCUIT DEVICE (18183505)

Main Inventor

Tongyan Zhai

VIA STRUCTURES IN BONDED GLASS SUBSTRATES (18121264)

Main Inventor

Sashi S. KANDANUR

Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit Devices (18670390)

Main Inventor

Chee Hak Teh

INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS (18120910)

Main Inventor

Pezhman MONADGEMI

FIDUCIAL DESIGN OPTIMIZATION FOR LAND SIDE DEVICE ANYWHERE PACKAGE ASSEMBLY (18122250)

Main Inventor

Shishir Deshpande

REFLECTIVE INORGANIC THIN FILM FOR HIGH-DENSITY PANEL-SCALE RE-DISTRIBUTION LAYER (RDL) (18120904)

Main Inventor

Vidya JAYARAM

INTEGRATED CIRCUIT STRUCTURES HAVING SELF-ALIGNED UNIFORM GRID METAL GATE AND TRENCH CONTACT PLUG FOR TUB GATES (18121731)

Main Inventor

Dan S. LAVRIC

FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING TUNED UPPER NANOWIRES (18121720)

Main Inventor

Dan S. LAVRIC

INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORM GRID METAL GATE AND TRENCH CONTACT PLUG FOR TUB GATES WITH PYRAMIDAL CHANNEL STRUCTURES (18121724)

Main Inventor

Dan S. LAVRIC

INTEGRATED CIRCUIT STRUCTURE WITH BACK-SIDE CONTACT SELECTIVITY (18121701)

Main Inventor

Ehren MANNEBACH

RADIO EQUIPMENT DIRECTIVE SOLUTIONS FOR REQUIREMENTS ON CYBERSECURITY, PRIVACY AND PROTECTION OF THE NETWORK (18549806)

Main Inventor

Markus Dominik MUECK

NETWORK INTERFACE FOR DATA TRANSPORT IN HETEROGENEOUS COMPUTING ENVIRONMENTS (18417570)

Main Inventor

Pratik M. MAROLIA

LEARNING-BASED DATA COMPRESSION METHOD AND SYSTEM FOR INTER-SYSTEM OR INTER-COMPONENT COMMUNICATIONS (18574809)

Main Inventor

Wenjie WANG

PROGRAMMABLE INTEGRATED CIRCUIT CONFIGURED AS A REMOTE TRUST ANCHOR TO SUPPORT MULTITENANCY (18410707)

Main Inventor

Steffen Schulz

AUTOMATIC PROJECTION CORRECTION (18568780)

Main Inventor

Bo PENG

METHODS AND APPARATUS TO MODEL VOLUMETRIC REPRESENTATIONS (18521937)

Main Inventor

David Israel Gonzalez Aguirre

APPARATUS, SYSTEM, AND METHOD OF COMMUNICATING CELLULAR QUALITY OF SERVICE (QOS) INFORMATION (18399512)

Main Inventor

Dibakar Das

ENHANCED QUALITY OF SERVICE FOR 5G WIRELESS COMMUNICATIONS (18412153)

Main Inventor

Necati CANPOLAT

SMALL DATA TRANSMISSION (SDT) PROCEDURES AND FAILURE RECOVERY DURING AN INACTIVE STATE (18604121)

Main Inventor

Sudeep K. Palat

THERMAL SOLUTIONS FOR COOLING ELECTRONIC DEVICES (18121297)

Main Inventor

Jeff Ku

PCB FABRICATION WITH EMI FILM ON MULTI-LAYER RIGID PCB (18123049)

Main Inventor

Arumanayagam RAJASEKAR

IMPROVEMENTS TO FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELECTRONIC SYSTEMS (18671881)

Main Inventor

Chen ZHANG