Intel Corporation patent applications published on October 10th, 2024
Summary of the patent applications from Intel Corporation on October 10th, 2024
1. **Summary**: Intel Corporation has recently filed patents for innovative technologies in the fields of 5G NR cell search, secure data sharing, high density interconnect devices, advanced interconnect bridge technology, and microelectronic assembly. These patents aim to enhance network connectivity, data security, device performance, and reliability in electronic devices.
2. **Key Points of Patents**: - UE designed for 5G NR system with efficient cell search using SS block frequency positions. - Encryption of data with homomorphic public key for secure data transmission and retrieval. - High density interconnect devices with embedded dice for improved interconnect density. - Interconnect bridge design with magnetic material layer for enhanced performance in electronic devices. - Microelectronic assembly involving direct bonding with metal contacts and dielectric materials.
3. **Notable Applications**: - Enhanced network infrastructure for telecommunications companies. - Secure data sharing in industries like healthcare and finance. - Improved performance and reliability of electronic devices. - Efficient interconnect solutions in semiconductor manufacturing. - Facilitation of secure collaboration and data sharing among multiple agents.
Contents
- 1 Patent applications for Intel Corporation on October 10th, 2024
- 1.1 Apparatus, device, method and computer program for an autonomously acting machine or a computer system (18393735)
- 1.2 Configurable Storage Circuits And Methods (18746853)
- 1.3 AUTOMATIC DETECTION OF DISPLAY LAYOUT (18131798)
- 1.4 Method and apparatus for anti-rollback protection for non-persistent software (18393733)
- 1.5 HOST TO GUEST NOTIFICATION (18574849)
- 1.6 UNIFIED ADDRESS TRANSLATION FOR VIRTUALIZATION OF INPUT/OUTPUT DEVICES (18745603)
- 1.7 METHODS AND APPARATUS TO DETERMINE A NUMBER OF DENOISING ITERATIONS FOR MODEL OUTPUT GENERATION (18745711)
- 1.8 ADAPTIVE BUFFER MANAGEMENT TO SUPPORT DYNAMIC TENSOR SHAPE IN DEEP NEURAL NETWORK APPLICATIONS (18574903)
- 1.9 METHODS AND APPARATUS FOR DATA-EFFICIENT CONTINUAL ADAPTATION TO POST-DEPLOYMENT NOVELTIES FOR AUTONOMOUS SYSTEMS (18744278)
- 1.10 CONTROL OF INPUT DIMENSIONS FOR COMPUTER VISION MODEL TRAINING (18747926)
- 1.11 AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER (18130582)
- 1.12 DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES (18746188)
- 1.13 EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY (18130584)
- 1.14 HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE (18749274)
- 1.15 APPARATUS, METHOD, AND SYSTEM (18531786)
- 1.16 CHANNEL RASTER AND SYNCHRONIZATION SIGNAL RASTER FOR OPERATING IN THE 57 GHZ TO 71 GHZ BAND (18290068)
Patent applications for Intel Corporation on October 10th, 2024
Apparatus, device, method and computer program for an autonomously acting machine or a computer system (18393735)
Main Inventor
Norbert STOEFFLER
Configurable Storage Circuits And Methods (18746853)
Main Inventor
Rajiv Kumar
AUTOMATIC DETECTION OF DISPLAY LAYOUT (18131798)
Main Inventor
Jose Rodrigo CAMACHO PEREZ
Method and apparatus for anti-rollback protection for non-persistent software (18393733)
Main Inventor
Dan HOROVITZ
HOST TO GUEST NOTIFICATION (18574849)
Main Inventor
Wei Wang
UNIFIED ADDRESS TRANSLATION FOR VIRTUALIZATION OF INPUT/OUTPUT DEVICES (18745603)
Main Inventor
Utkarsh Y. Kakaiya
METHODS AND APPARATUS TO DETERMINE A NUMBER OF DENOISING ITERATIONS FOR MODEL OUTPUT GENERATION (18745711)
Main Inventor
Jean Xu Yu
ADAPTIVE BUFFER MANAGEMENT TO SUPPORT DYNAMIC TENSOR SHAPE IN DEEP NEURAL NETWORK APPLICATIONS (18574903)
Main Inventor
Liyang LING
METHODS AND APPARATUS FOR DATA-EFFICIENT CONTINUAL ADAPTATION TO POST-DEPLOYMENT NOVELTIES FOR AUTONOMOUS SYSTEMS (18744278)
Main Inventor
Amanda Sofie Rios
CONTROL OF INPUT DIMENSIONS FOR COMPUTER VISION MODEL TRAINING (18747926)
Main Inventor
Songki Choi
AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER (18130582)
Main Inventor
Hiroki TANAKA
DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES (18746188)
Main Inventor
Aleksandar Aleksov
EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY (18130584)
Main Inventor
Cary KULIASHA
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE (18749274)
Main Inventor
Weng Hong TEH
APPARATUS, METHOD, AND SYSTEM (18531786)
Main Inventor
Ofer RIVLIN
CHANNEL RASTER AND SYNCHRONIZATION SIGNAL RASTER FOR OPERATING IN THE 57 GHZ TO 71 GHZ BAND (18290068)
Main Inventor
Prerana Rane
