Intel Corporation patent applications published on June 6th, 2024

From WikiPatents
Jump to navigation Jump to search

Summary of the patent applications from Intel Corporation on June 6th, 2024

1. **Summary**: Intel Corporation has recently filed patents for innovative methods in substrate manufacturing for electronic devices. The patents involve creating structured substrates with coplanar surfaces, integrating defect detection methods, and developing integrated circuit package substrates with multiple build-up layers. These technologies aim to enhance device performance, improve manufacturing efficiency, and ensure reliability in electronic products.

2. **Key Points of Patents**:

  * Method for manufacturing a structured substrate involving glass substrate with coplanar surfaces, formation of openings with sidewalls, application of layers, and deposition of metal.
  * Apparatus with two dispensing units and a connection assembly for adjusting their positions.
  * Method for creating a substrate core with glass core layer, through-glass vias, conductive layers, and defect detection.
  * Integrated circuit package substrate with core layer, build-up layers, and a cavity spanning across different layers.

3. **Notable Applications**:

  * These patents can be applied in microelectronics, optoelectronics, MEMS devices, telecommunications, aerospace, and medical devices industries.
  * The technologies can improve device performance, durability, and manufacturing efficiency in various electronic gadgets like smartphones and tablets.



Contents

Patent applications for Intel Corporation on June 6th, 2024

DRY METHOD FOR METAL-DEFINED PAD FORMATION (18060578)

Main Inventor

Tchefor NDUKUM


DYNAMIC VOLTAGE REGULATOR SENSING FOR CHIPLET-BASED DESIGNS (18076352)

Main Inventor

Vikrant Thigle


OPTICAL MODE CONVERTOR (18496672)

Main Inventor

Harel Frish


OPTICAL FIBER POSITIONING APPARATUS COMPRISING ONE OR MORE GROOVES AND PASSAGES (18553410)

Main Inventor

Nicholas D. PSAILA


OPTICAL FIBER POSITIONING APPARATUS (18553361)

Main Inventor

Richard Laming


LITHOGRAPHIC PROCESSES FOR MAKING POLYMER-BASED ELEMENTS (18060593)

Main Inventor

Changhua LIU


TOOL ANOMALY IDENTIFICATION DEVICE AND METHOD FOR IDENTIFYING TOOL ANOMALIES (18060576)

Main Inventor

Mohammad Mamunur RAHMAN


METHODS AND APPARATUS TO PERFORM MIXED RADIX FAST FOURIER TRANSFORM (FFT) CALCULATIONS ON GRAPHICS PROCESSING UNITS (GPUs) (18553185)

Main Inventor

Bin Wang


INSTRUCTIONS AND LOGIC TO PERFORM FLOATING POINT AND INTEGER OPERATIONS FOR MACHINE LEARNING (18528340)

Main Inventor

Himanshu Kaul


NEOHARRY: HIGH-PERFORMANCE PARALLEL MULTI-LITERAL MATCHING ALGORITHM (18440818)

Main Inventor

Hao CHANG


BFLOAT16 COMPARISON INSTRUCTIONS (18436982)

Main Inventor

Alexander HEINECKE


ACCELERATING PARA-VIRTUALIZATION OF A NETWORK INTERFACE USING DIRECT MEMORY ACCESS (DMA) REMAPPING (18388505)

Main Inventor

Yigang ZHOU


Firmware Apparatus, Device, Method and Computer Program (18570132)

Main Inventor

Sarathy JAYAKUMAR


DISAGGREGATED COMPUTING FOR DISTRIBUTED CONFIDENTIAL COMPUTING ENVIRONMENT (18538171)

Main Inventor

Reshma Lal


PROCESSORS, METHODS, SYSTEMS, AND INSTRUCTIONS TO SUPPORT LIVE MIGRATION OF PROTECTED CONTAINERS (18378124)

Main Inventor

Carlos V. Rozas


DYNAMIC MEMORY RECONFIGURATION (18432859)

Main Inventor

Joydeep RAY


IMPORTANCE-AWARE MODEL PRUNING AND RE-TRAINING FOR EFFICIENT CONVOLUTIONAL NEURAL NETWORKS (18411542)

Main Inventor

Anbang Yao


METHODS AND APPARATUS TO FACILITATE COLLABORATIVE LEARNING IN A MULTI-SENSOR ENVIRONMENT (18415588)

Main Inventor

Priyanka Mudgal


NETWORK FOR STRUCTURE-BASED TEXT-TO-IMAGE GENERATION (18400561)

Main Inventor

Peixi Xiong


TILE SEQUENCING MECHANISM (18409753)

Main Inventor

Subramaniam Maiyuran


PRIVACY-PRESERVING DISTRIBUTED VISUAL DATA PROCESSING (18496442)

Main Inventor

Shao-Wen Yang


SYSTEMS, DEVICES, AND METHODS FOR ADAPTING TRAFFIC TO PRIORITIZED VEHICLE ROUTES (18556367)

Main Inventor

Satish JHA


METHOD AND SYSTEM OF AUDIO FALSE KEYPHRASE REJECTION USING SPEAKER RECOGNITION (18367180)

Main Inventor

Jacek Ossowski


A memory device, a memory module, a computing system, a method for erasing a memory portion of a memory device and a method for generating an erase request (18547910)

Main Inventor

Shuo LIU


SPUTTER TARGETS FOR SELF-DOPED SOURCE AND DRAIN CONTACTS (18399237)

Main Inventor

Ilya V. Karpov


POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIELECTRIC OR METAL-DIELECTRIC INTERFACES (18061126)

Main Inventor

Mahdi Mohammadighaleni


SUBSTRATE ARCHITECTURE FOR ENHANCED ELECTROSTATIC CHUCKING (18060592)

Main Inventor

Aaditya Anand CANDADAI


PACKAGE WITH UNDERFILL CONTAINMENT BARRIER (18415268)

Main Inventor

Rahul JAIN


INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY (18438450)

Main Inventor

Satish PRATHABAN


INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) (18061181)

Main Inventor

Haobo Chen


INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) (18061237)

Main Inventor

Haobo Chen


INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) (18061283)

Main Inventor

Whitney M. Bryks


Microelectronic Assembly Including Interconnect Bridges with Through Vias Embedded Therein (18061188)

Main Inventor

Jeremy D. Ecton


SYMMETRIC DUMMY BRIDGE DESIGN FOR FLI ALIGNMENT IMPROVEMENT (18075360)

Main Inventor

Minglu LIU


STRUCTURE AND PROCESS FOR WARPAGE REDUCTION (18060574)

Main Inventor

Hong Seung YEON


POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES (18061083)

Main Inventor

Yi Yang


MICROELECTRONIC ASSEMBLY HAVING ANTIFERROMAGNETIC FILM STRUCTURE THEREIN (18074253)

Main Inventor

Srinivas V. Pietambaram


IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVICE ATTACHMENT (18060577)

Main Inventor

Minglu LIU


THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING (18060596)

Main Inventor

Minglu LIU


METHOD FOR PANEL-LEVEL THERMO-COMPRESSION BONDING (18060617)

Main Inventor

Minglu LIU


GATE-ALL-AROUND DEVICES WITH DIFFERENT GATE OXIDE THICKNESSES (18074814)

Main Inventor

Hwichan Jun


GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING EMBEDDED GESNB SOURCE OR DRAIN STRUCTURES (18440526)

Main Inventor

Cory BOMBERGER


LINED CONDUCTIVE STRUCTURES FOR TRENCH CONTACT (18076130)

Main Inventor

Krishna GANESAN


INTEGRATED CIRCUIT STRUCTURES WITH CAVITY SPACERS (18073213)

Main Inventor

Aaron D. LILAK


DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION (18439225)

Main Inventor

Jeffrey S. LEIB


TMD INVERTED NANOWIRE INTEGRATION (18414290)

Main Inventor

Kevin P. O'Brien


ANALOG-TO-DIGITAL CONVERTER SYSTEM, RECEIVER, BASE STATION, MOBILE DEVICE AND METHOD FOR ANALOG-TO-DIGITAL CONVERSION (18553212)

Main Inventor

Matteo CAMPONESCHI


TIME DOMAIN RESTRICTION FOR CHANNEL STATE INFORMATION REFERENCE SIGNAL CONFIGURATION (18553279)

Main Inventor

Hua LI


SINGLE TRP AND MULTIPLE TRP DYNAMIC SWITCHING FOR SINGLE DCI BASED PUSCH TRANSMISSIONS (18549805)

Main Inventor

Alexei Davydov


SOUNDING REFERENCE SIGNAL CONFIGURATION FOR ANTENNA SWITCHING AND CARRIER SWITCHING (18549325)

Main Inventor

Guotong Wang


OUT-OF-ORDER HANDLING FOR TBOMS SCHEDULING IN 5G NR (18287707)

Main Inventor

Gang Xiong


ENHANCED PREAMBLE FOR 60 GIGAHERTZ OPERATION (18401102)

Main Inventor

Thomas J. KENNEY


METHODS AND APPARATUS TO MANAGE TELEMETRY DATA IN COMPUTING SYSTEMS (18399569)

Main Inventor

Malini K. Bhandaru


ENHANCED SERVICE FUNCTION CHAINING IN NEXT GENERATION CELLULAR NETWORKS (18553240)

Main Inventor

Zongrui DING


ENHANCED SERVICE CLASSIFICATION FOR SERVICE FUNCTION CHAINING IN NEXT GENERATION CELLULAR NETWORKS (18553425)

Main Inventor

Zongrui DING


SESSION DESCRIPTION PROTOCOL (SDP) BASED SIGNALING OF CAMERA CALIBRATION PARAMETERS (18493277)

Main Inventor

Ozgur Oyman


METHODS AND APPARATUS FOR POWER HEADROOM REPORTING FOR MULTIPLE TRANSMISSION RECEPTION POINT (MULTI-TRP) TRANSMISSIONS (18553322)

Main Inventor

Dong HAN


SUPPORT FOR MOBILE TERMINATED SMALL DATA TRANSMISSION IN FIFTH GENERATION SYSTEMS (18441716)

Main Inventor

Marta Martinez Tarradell


ENHANCEMENTS TO TIME-SENSITIVE NETWORKING CONFIGURATION FOR SUPPORTING WIRELESS TSN LINKS (18553354)

Main Inventor

Dave CAVALCANTI


CROSS-CARRIER SCHEDULING WITH DIFFERENT CELL NUMEROLOGIES (18283066)

Main Inventor

Yingyang Li


DEFAULT BEAM OPERATIONS FOR UPLINK TRANSMISSIONS (18550092)

Main Inventor

Guotong Wang


PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING (18061109)

Main Inventor

Mohammad Mamunur Rahman


METHOD OF FORMING A PACKAGE SUBSTRATE (18060595)

Main Inventor

Rahul MANEPALLI


MATERIAL DEPOSITION APPARATUS AND METHOD (18060581)

Main Inventor

Zhixin XIE


GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS (18060598)

Main Inventor

Vinith BEJUGAM