Innolux corporation (20240297132). SUBSTRATE ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract
Contents
SUBSTRATE ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME
Organization Name
Inventor(s)
Pierre Chen of Tainan City (TW)
SUBSTRATE ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240297132 titled 'SUBSTRATE ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME
Simplified Explanation: The patent application describes a substrate assembly for an electronic device, consisting of layers of metal and conductive material separated by insulating layers.
- The substrate assembly includes a substrate, a first metal layer, a second metal layer, a third conductive layer, and an insulating layer.
- The first metal layer is on the substrate, with the second metal layer also on the substrate.
- The third conductive layer is between the first and second metal layers, overlapping with parts of both.
- An insulating layer separates the first and second metal layers, with an opening for electrical connection between them.
Key Features and Innovation:
- Multilayer structure with metal and conductive layers.
- Insulating layer for electrical isolation.
- Overlapping conductive layer for connection between metal layers.
Potential Applications:
- Circuit boards
- Microelectronics
- Sensors
Problems Solved:
- Ensuring proper electrical connections between metal layers.
- Providing insulation to prevent short circuits.
Benefits:
- Improved reliability of electronic devices.
- Enhanced performance due to optimized electrical connections.
Commercial Applications: The technology could be used in the manufacturing of various electronic devices, such as smartphones, tablets, and computers, to improve their performance and reliability.
Prior Art: Readers can start searching for prior art related to multilayer substrate assemblies in the field of electronic device manufacturing.
Frequently Updated Research: Stay updated on advancements in multilayer substrate assembly technology for electronic devices to ensure the latest innovations are incorporated.
Questions about Multilayer Substrate Assemblies: 1. What are the key advantages of using a multilayer substrate assembly in electronic devices? 2. How does the overlapping conductive layer improve the functionality of the substrate assembly?
Original Abstract Submitted
a substrate assembly and an electronic device are provided. the substrate assembly includes a substrate, a first metal layer, a second metal layer, a third conductive layer, and an insulating layer. the first metal layer is disposed on the substrate. the second metal layer is disposed on the substrate. the third conductive layer is disposed between the first metal layer and the second metal layer, wherein the third conductive layer overlaps with a part of the first metal layer and overlaps a part of the second metal layer. the insulating layer is disposed between the first metal layer and the second metal layer and has an opening through which the part of the first metal layer and the second metal layer are electrically connected with each other.
