Innolux corporation (20240295783). ELECTRONIC DEVICE simplified abstract

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ELECTRONIC DEVICE

Organization Name

innolux corporation

Inventor(s)

Chun-Hsien Lin of Miao-Li County (TW)

ELECTRONIC DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240295783 titled 'ELECTRONIC DEVICE

The abstract describes an electronic device with a conductive structure, a semiconductor, a first insulation layer, and a second insulation layer. The semiconductor is connected to the conductive structure, with the first insulation layer between them. The first insulation layer has a hole that overlaps part of the conductive structure, while the second insulation layer also has a hole that partially overlaps the first hole. The width of the second hole is smaller than the width of the first hole.

  • The electronic device includes a unique design with overlapping holes in the insulation layers.
  • The semiconductor is electrically connected to the conductive structure for efficient operation.
  • The first insulation layer provides a barrier between the conductive structure and the second insulation layer.
  • The size difference between the first and second holes allows for precise control and functionality of the device.
  • This innovation may lead to improved performance and reliability in electronic devices.

Potential Applications: - This technology could be used in the development of advanced electronic devices such as smartphones, tablets, and computers. - It may also find applications in the automotive industry for vehicle electronics and control systems.

Problems Solved: - Provides enhanced insulation and protection for the semiconductor and conductive structure. - Offers a more compact and efficient design for electronic devices.

Benefits: - Improved performance and reliability. - Enhanced control and functionality. - Potential for miniaturization and space-saving in device design.

Commercial Applications: Title: Advanced Electronic Device Design for Enhanced Performance This technology could be utilized by electronics manufacturers to create cutting-edge devices with improved functionality and reliability. The market implications include increased competitiveness and consumer demand for innovative products.

Questions about the Technology: 1. How does the size difference between the first and second holes impact the overall performance of the electronic device? 2. What potential industries could benefit the most from the implementation of this technology?

Frequently Updated Research: Stay updated on the latest advancements in electronic device design and semiconductor technology to ensure the continued relevance and competitiveness of products incorporating this innovation.


Original Abstract Submitted

an electronic device includes a conductive structure, a semiconductor, a first insulation layer and a second insulation layer. the semiconductor is electrically connected to the conductive structure. the first insulation layer is disposed between the conductive structure and the second insulation layer. the first insulation layer includes a first hole, and the first hole overlaps a part of the conductive structure. the second insulation layer includes a second hole, and the first hole and the second hole at least partially overlap. along a direction, a width of the second hole is less than a width of the first hole.