Infineon technologies ag (20240250056). SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE simplified abstract

SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE

Organization Name

infineon technologies ag

Inventor(s)

Mohd Afiz Hashim of Shah Alam (MY)

Zhi Yuan Goh of Bertam (MY)

Subaramaniym Senivasan of Bemban (MY)

Azmil Abdullah of Merlimau (MY)

Varun Parthasarathy of Johor Bahru (MY)

Kah Wai Lau of Duyung (MY)

Ahmad Zulkarnain Samsudin of Seremban (MY)

SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240250056 titled 'SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE

The semiconductor package described in the patent application consists of a substrate with a metallic surface, a semiconductor die bonded to the substrate with a solder joint, and a solder wetting structure welded to the metallic surface of the substrate outside the perimeter of the semiconductor die.

• The semiconductor die is metallurgically bonded to the metallic surface of the substrate by a first solder joint.
• A solder wetting structure is metallurgically welded to the metallic surface of the substrate outside the perimeter of the semiconductor die and adjacent to one or more side faces of the semiconductor die.
• Excess solder squeezed out from under the semiconductor die is metallurgically bonded to the solder wetting structure.
• The methods of producing the semiconductor package and solder wetting structure are also described.

Potential Applications: - This technology can be used in the manufacturing of various semiconductor devices. - It can improve the reliability and performance of semiconductor packages in electronic devices.

Problems Solved: - Enhances the bonding and reliability of semiconductor packages. - Provides a more efficient method for producing semiconductor packages.

Benefits: - Improved bonding between the semiconductor die and the substrate. - Enhanced reliability and performance of semiconductor devices.

Commercial Applications: - This technology can be applied in the production of consumer electronics, automotive electronics, and industrial equipment.

Questions about Semiconductor Package Technology: 1. How does the solder wetting structure improve the reliability of the semiconductor package? 2. What are the potential cost savings associated with using this technology in semiconductor manufacturing processes?

Frequently Updated Research: - Stay updated on the latest advancements in semiconductor packaging technology to ensure optimal performance and reliability in electronic devices.

Original Abstract Submitted

a semiconductor package includes: a substrate having a metallic surface; a semiconductor die metallurgically bonded to the metallic surface of the substrate by a first solder joint; and a solder wetting structure metallurgically welded to the metallic surface of the substrate outside a perimeter of the semiconductor die and adjacent to one or more side faces of the semiconductor die. excess solder squeezed out from under the semiconductor die is metallurgically bonded to the solder wetting structure. methods of producing the semiconductor package and solder wetting structure are also described.