Infineon Technologies AG patent applications published on September 12th, 2024
Summary of the patent applications from Infineon Technologies AG on September 12th, 2024
1. **Summary**: Infineon Technologies AG has recently filed patents for innovative technologies in power semiconductor modules and devices. These patents focus on enhancing conductivity, heat dissipation, and overall performance in electronic systems. The technologies include structured metallization layers, vertical power transistor dies, and multi-level lead frames for efficient power distribution and improved reliability.
2. **Key Points of Patents**:
- Power semiconductor module arrangement with structured metallization layers and electrically conducting elements for enhanced conductivity and heat dissipation.
- Semiconductor device with trench transistor cell array featuring two units with different threshold voltages for precise voltage control.
- Power module design with vertical power transistor dies, patterned metallization on substrates, and a multi-level lead frame for efficient power distribution.
3. **Notable Applications**:
- Power electronics, renewable energy systems, and electric vehicles can benefit from the improved performance and reliability offered by these patented technologies.
- The technologies can be applied in various industries such as automotive, renewable energy, industrial automation, and consumer electronics for high-power applications.
Contents
- 1 Patent applications for Infineon Technologies AG on September 12th, 2024
- 1.1 ELECTRONIC INHALATION APPARATUS WITH A CHIP MODULE FIXED WITH A FOLDING STRUCTURE (18668518)
- 1.2 BROADBAND ULTRASONIC TRANSDUCER (18591858)
- 1.3 Semiconductor Device Testing with Lead Extender (18119076)
- 1.4 HIGH THROUGHPUT SORT (18179593)
- 1.5 IRIDIUM-MANGANESE-BASED TUNNEL MAGNETORESISTANCE SENSING ELEMENT WITH TANTALUM-NITRIDE BUFFER LAYER FOR INCREASED THERMAL STABILITY (18180600)
- 1.6 APPARATUS, RADAR SYSTEM, ELECTRONIC DEVICE AND METHOD (18583528)
- 1.7 SYNCHRONIZATION OF MICROELECTROMECHANICAL SYSTEM (MEMS) MIRRORS (18665650)
- 1.8 POWER MODULE HAVING A MULTI-LEVEL LEAD FRAME (18426415)
- 1.9 SEMICONDUCTOR MODULE ARRANGEMENT (18591580)
- 1.10 SEMICONDUCTOR DEVICE INCLUDING TRENCH TRANSISTOR CELL UNITS (18583993)
- 1.11 THERMAL ELEMENT FOR A CURRENT SENSING STRUCTURE (18181994)
Patent applications for Infineon Technologies AG on September 12th, 2024
ELECTRONIC INHALATION APPARATUS WITH A CHIP MODULE FIXED WITH A FOLDING STRUCTURE (18668518)
Main Inventor
Jens Pohl
BROADBAND ULTRASONIC TRANSDUCER (18591858)
Main Inventor
Erhard LANDGRAF
Semiconductor Device Testing with Lead Extender (18119076)
Main Inventor
Soon Lai Kho
HIGH THROUGHPUT SORT (18179593)
Main Inventor
David Addison
IRIDIUM-MANGANESE-BASED TUNNEL MAGNETORESISTANCE SENSING ELEMENT WITH TANTALUM-NITRIDE BUFFER LAYER FOR INCREASED THERMAL STABILITY (18180600)
Main Inventor
Bernhard ENDRES
APPARATUS, RADAR SYSTEM, ELECTRONIC DEVICE AND METHOD (18583528)
Main Inventor
Abhilash Govinda Kammath
SYNCHRONIZATION OF MICROELECTROMECHANICAL SYSTEM (MEMS) MIRRORS (18665650)
Main Inventor
Norbert DRUML
POWER MODULE HAVING A MULTI-LEVEL LEAD FRAME (18426415)
Main Inventor
Dominic Raithel
SEMICONDUCTOR MODULE ARRANGEMENT (18591580)
Main Inventor
Christoph Bayer
SEMICONDUCTOR DEVICE INCLUDING TRENCH TRANSISTOR CELL UNITS (18583993)
Main Inventor
Alexander Philippou
THERMAL ELEMENT FOR A CURRENT SENSING STRUCTURE (18181994)
Main Inventor
Dietmar SPITZER