Hyundai motor company (20240178147). POWER MODULE simplified abstract
Contents
- 1 POWER MODULE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POWER MODULE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
POWER MODULE
Organization Name
Inventor(s)
Jin Myeong Yang of Seongnam-Si (KR)
POWER MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178147 titled 'POWER MODULE
Simplified Explanation
The power module described in the patent application consists of various components such as upper and lower substrates, semiconductor chips, spacers, connection layers, and power leads. The first spacer and second spacer are designed to connect different layers within the module, allowing for efficient electrical connections.
- Upper and lower substrates provide a structural base for the power module.
- Spacers are used to connect different layers within the module electrically.
- Connection layers facilitate the penetration of spacers within the module.
- Power lead enables the transmission of power within the module.
Potential Applications
The technology described in this patent application could be applied in various industries such as electronics, automotive, renewable energy, and telecommunications.
Problems Solved
This technology solves the problem of inefficient electrical connections within power modules, leading to improved performance and reliability.
Benefits
The benefits of this technology include enhanced electrical connectivity, increased efficiency, and improved overall performance of power modules.
Potential Commercial Applications
The potential commercial applications of this technology include power electronics, electric vehicles, solar inverters, and industrial automation systems.
Possible Prior Art
One possible prior art in this field could be the use of traditional power module designs with less efficient electrical connections compared to the innovative approach described in this patent application.
Unanswered Questions
How does this technology compare to existing power module designs in terms of efficiency and reliability?
The article does not provide a direct comparison between this technology and existing power module designs in terms of efficiency and reliability.
What are the specific industries that could benefit the most from this technology?
The article does not specify the specific industries that could benefit the most from the technology described in the patent application.
Original Abstract Submitted
a power module includes an upper substrate, a lower substrate, a first semiconductor chip, a first spacer configured to electrically connect a first metal layer to a second metal layer, a second spacer configured to electrically connect the first semiconductor chip to the first metal layer, a first connection layer having conductivity, disposed between the upper substrate and the lower substrate, and configured to allow the first spacer and the second spacer to penetrate the first connection layer, and a power lead.
