Hyundai motor company (20240096737). MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME simplified abstract
Contents
- 1 MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME
Organization Name
Inventor(s)
Jun Hee Park of Hwaseong-si (KR)
MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096737 titled 'MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME
Simplified Explanation
The abstract describes a patent application for a multi-layered spacer with controllable thermal expansion coefficient and thermal conductivity, used in a double-sided cooling power module between a semiconductor chip and a substrate.
- The multi-layered spacer includes first metal layers as outermost layers and a second metal layer with a lower thermal expansion coefficient between them.
- The spacer allows for control over thermal expansion and conductivity, improving heat dissipation in the cooling power module.
Potential Applications
The technology can be applied in various electronic devices requiring efficient heat dissipation, such as computers, smartphones, and servers.
Problems Solved
The innovation addresses the challenge of managing thermal expansion and conductivity mismatch between different materials in cooling systems, ensuring optimal performance and reliability.
Benefits
- Improved heat dissipation efficiency - Enhanced thermal management in electronic devices - Increased reliability and longevity of semiconductor chips
Potential Commercial Applications
"Enhanced Heat Dissipation Technology for Electronic Devices"
Possible Prior Art
Prior art may include patents related to thermal management systems in electronic devices, such as heat sinks and thermal interface materials.
Unanswered Questions
1. What specific materials are used in the first and second metal layers of the multi-layered spacer? 2. How does the controllable thermal expansion coefficient of the spacer contribute to the overall performance of the cooling power module?
Original Abstract Submitted
a multi-layered spacer of which a thermal expansion coefficient and a thermal conductivity are controllable and a double-sided cooling power module including the multi-layered spacer, is provided between a semiconductor chip and a substrate in a double-sided cooling power module. the multi-spacer includes first metal layers made of a first metal and provided as at least respective outermost layers, and a second metal layer made of a second metal having a thermal expansion coefficient lower than a thermal expansion coefficient of the first metal and disposed between the first metal layers provided as the outermost layers.
